Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7203390 | Planar lightwave circuit package | Douglas E. Crafts, James F. Farrell, Mark Farrelly, Satyanarayana Rao Peddada | 2007-04-10 |
| 7141448 | Controlled collapse chip connection (C4) integrated circuit package which has two dissimilar underfill materials | Suresh Ramalingam, Venkatesan Murali | 2006-11-28 |
| 6945708 | Planar lightwave circuit package | Douglas E. Crafts, James F. Farrell, Mark Farrelly, Satyanarayana Rao Peddada | 2005-09-20 |
| 6907147 | Method and apparatus for aligning and orienting polarization maintaining optical fibers | Douglas E. Crafts, Arne Schonert, Steve Swain | 2005-06-14 |
| 6606425 | Transfer molded packages with embedded thermal insulation | Douglas E. Crafts, Kenzo Ishida, David J. Chapman, James F. Farrell, Suresh Ramalingam +1 more | 2003-08-12 |
| 6528345 | Process line for underfilling a controlled collapse | Suresh Ramalingam | 2003-03-04 |
| 6331446 | Process for underfilling a controlled collapse chip connection (C4) integrated circuit package with an underfill material that is heated to a partial gel state | Venkatesan Murali, Suresh Ramalingam, Nagesh Vodrahalli | 2001-12-18 |