| 7203390 |
Planar lightwave circuit package |
Douglas E. Crafts, James F. Farrell, Mark Farrelly, Satyanarayana Rao Peddada |
2007-04-10 |
| 7141448 |
Controlled collapse chip connection (C4) integrated circuit package which has two dissimilar underfill materials |
Suresh Ramalingam, Venkatesan Murali |
2006-11-28 |
| 6945708 |
Planar lightwave circuit package |
Douglas E. Crafts, James F. Farrell, Mark Farrelly, Satyanarayana Rao Peddada |
2005-09-20 |
| 6907147 |
Method and apparatus for aligning and orienting polarization maintaining optical fibers |
Douglas E. Crafts, Arne Schonert, Steve Swain |
2005-06-14 |
| 6606425 |
Transfer molded packages with embedded thermal insulation |
Douglas E. Crafts, Kenzo Ishida, David J. Chapman, James F. Farrell, Suresh Ramalingam +1 more |
2003-08-12 |
| 6528345 |
Process line for underfilling a controlled collapse |
Suresh Ramalingam |
2003-03-04 |
| 6331446 |
Process for underfilling a controlled collapse chip connection (C4) integrated circuit package with an underfill material that is heated to a partial gel state |
Venkatesan Murali, Suresh Ramalingam, Nagesh Vodrahalli |
2001-12-18 |