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Home › Process for underfilling a controlled collapse chip connection (C4) integrated circuit package with an underfill material that is heated to a partial gel state

Process for underfilling a controlled collapse chip connection (C4) integrated circuit package with an underfill material that is heated to a partial gel state

US Patent 6331446 · Granted Dec 18, 2001

Estimated economic value: $522,550,000 ⓘ

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