Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Frame for coupling of a thermal management device to a printed circuit board

Frame for coupling of a thermal management device to a printed circuit board

US Patent 12324101 · Granted Jun 3, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic device with below PCB thermal management2025
Intravascular ultrasound patient interface module (PIM) for distributed wireless2025
Heat spreader for a semiconductor package2025
Heat spreader for a semiconductor package2025
Chip package with near-die integrated passive device2024
Functional measurement patient interface module (PIM) for distributed wireless i2024
Semiconductor chip with redundant thru-silicon-vias2024
Fanout integration for stacked silicon package assembly2024
Intravascular ultrasound patient interface module (PIM) for distributed wireless2024
Heterogeneous integration module comprising thermal management apparatus2023
Heterogeneous integration module comprising thermal management apparatus2023
Radome with integrated passive cooling2023