Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Heterogeneous integration module comprising thermal management apparatus

Heterogeneous integration module comprising thermal management apparatus

US Patent 11769710 · Granted Sep 26, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods and apparatuses for wavelength locking for optical wavelength division m2025
Methods and apparatuses for wavelength locking for optical wavelength division m2025
Methods and apparatuses for maximizing output modulation amplitude for optical w2025
Methods and apparatuses for maximizing output modulation amplitude for optical w2025
Methods and apparatuses for maximizing output modulation amplitude for optical w2025
Electronic device with below PCB thermal management2025
Frame for coupling of a thermal management device to a printed circuit board2025
Frame for coupling of a thermal management device to a printed circuit board2025
Heat spreader for a semiconductor package2025
Heat spreader for a semiconductor package2025
Chip package with near-die integrated passive device2024
Circuits and methods for digital DC stabilization of optical receivers2024