Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Transfer molded packages with embedded thermal insulation

Transfer molded packages with embedded thermal insulation

US Patent 6606425 · Granted Aug 12, 2003

Estimated economic value: $18,422,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Frame for coupling of a thermal management device to a printed circuit board2025
Heat spreader for a semiconductor package2025
Chip package with near-die integrated passive device2024
Magnetic mat device2024
Fanout integration for stacked silicon package assembly2024
Heterogeneous integration module comprising thermal management apparatus2023
Glass fiber hole plates for 2D fiber collimators and methods for alignment and f2023
Radome with integrated passive cooling2023
Thermal enablement of dies with impurity gettering2022
Stacked silicon package assembly having vertical thermal management2022
Remote active cooling heat exchanger and antenna system with the same2022
Thermal heat spreader plate for electronic device2022