Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6030854 | Method for producing a multilayer interconnection structure | Shuji Inoue, Jiro Kubota, Mashahiro Kuroda | 2000-02-29 |
| 6020561 | Printed circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereof | Kenzo Ishida, Kinya Ichikawa | 2000-02-01 |
| 5880530 | Multiregion solder interconnection structure | Shuji Inoue, Jiro Kubota, Mashahiro Kuroda | 1999-03-09 |
| 5811883 | Design for flip chip joint pad/LGA pad | Kinya Ichikawa, Seiichiroh Seki, Takaya Miwa | 1998-09-22 |
| 5660321 | Method for controlling solder bump height and volume for substrates containing both pad-on and pad-off via contacts | Kenzo Ishida, Kinya Ichikawa | 1997-08-26 |