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Picture frame stiffeners for microelectronic packages |
Yoshihiro Tomita, Omkar G. Karhade, Shawna M. Liff, Kinya Ichikawa, Nitin A. Deshpande |
2017-06-20 |
| 9502368 |
Picture frame stiffeners for microelectronic packages |
Yoshihiro Tomita, Omkar G. Karhade, Shawna M. Liff, Kinya Ichikawa, Nitin A. Deshpande |
2016-11-22 |
| 7132311 |
Encapsulation of a stack of semiconductor dice |
Masayuki Akiba, Kinya Ichikawa, Takashi Kumamoto |
2006-11-07 |
| 7132739 |
Encapsulated stack of dice and support therefor |
Masayuki Akiba, Kinya Ichikawa, Takashi Kumamoto |
2006-11-07 |
| 6495397 |
Fluxless flip chip interconnection |
Kenji Takahashi |
2002-12-17 |
| 6030854 |
Method for producing a multilayer interconnection structure |
Yohko Mashimoto, Shuji Inoue, Mashahiro Kuroda |
2000-02-29 |
| 5880530 |
Multiregion solder interconnection structure |
Yohko Mashimoto, Shuji Inoue, Mashahiro Kuroda |
1999-03-09 |