Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9685388 | Picture frame stiffeners for microelectronic packages | Yoshihiro Tomita, Omkar G. Karhade, Shawna M. Liff, Kinya Ichikawa, Nitin A. Deshpande | 2017-06-20 |
| 9502368 | Picture frame stiffeners for microelectronic packages | Yoshihiro Tomita, Omkar G. Karhade, Shawna M. Liff, Kinya Ichikawa, Nitin A. Deshpande | 2016-11-22 |
| 7132311 | Encapsulation of a stack of semiconductor dice | Masayuki Akiba, Kinya Ichikawa, Takashi Kumamoto | 2006-11-07 |
| 7132739 | Encapsulated stack of dice and support therefor | Masayuki Akiba, Kinya Ichikawa, Takashi Kumamoto | 2006-11-07 |
| 6495397 | Fluxless flip chip interconnection | Kenji Takahashi | 2002-12-17 |
| 6030854 | Method for producing a multilayer interconnection structure | Yohko Mashimoto, Shuji Inoue, Mashahiro Kuroda | 2000-02-29 |
| 5880530 | Multiregion solder interconnection structure | Yohko Mashimoto, Shuji Inoue, Mashahiro Kuroda | 1999-03-09 |