| 12107042 |
Localized high density substrate routing |
Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan |
2024-10-01 |
$20,560,000 |
| 11984396 |
Localized high density substrate routing |
Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan |
2024-05-14 |
$33,809,000 |
| 11923257 |
Hybrid microelectronic substrates |
Robert L. Sankman, Scott M. Mokler, Richard C. Stamey, Amruthavalli Pallavi Alur |
2024-03-05 |
$29,696,000 |
| 11515248 |
Localized high density substrate routing |
Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan |
2022-11-29 |
$14,086,000 |
| 11444033 |
Hybrid microelectronic substrate and methods for fabricating the same |
Robert L. Sankman, Scott M. Mokler, Richard C. Stamey |
2022-09-13 |
$14,653,000 |
| 11114353 |
Hybrid microelectronic substrates |
Robert L. Sankman, Scott M. Mokler, Richard C. Stamey, Amruthavalli Pallavi Alur |
2021-09-07 |
$31,495,000 |
| 11022792 |
Coupling a magnet with a MEMS device |
Kyle Yazzie, Anna M. Prakash, Suriyakala Ramalingam, Liwei Wang, Arnab Choudhury +3 more |
2021-06-01 |
$35,542,000 |
| 10796988 |
Localized high density substrate routing |
Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan |
2020-10-06 |
$29,609,000 |
| 10763215 |
Hybrid microelectronic substrate and methods for fabricating the same |
Robert L. Sankman, Scott M. Mokler, Richard C. Stamey |
2020-09-01 |
$24,773,000 |
| 10716214 |
Hybrid microelectronic substrate and methods for fabricating the same |
Richard C. Stamey, Robert L. Sankman, Scott M. Mokler |
2020-07-14 |
$28,563,000 |
| 10366951 |
Localized high density substrate routing |
Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravindranath V. Mahajan |
2019-07-30 |
$29,864,000 |
| 10304769 |
Multi-die package |
Robert L. Sankman, Allan A. Ovrom, III, Oren Arad |
2019-05-28 |
$17,387,000 |
| 10125013 |
Microelectromechanical system with spring for magnet placement |
Amanuel M. Abebaw, Liwei Wang, Mark Saltas, Sandeep S. Iyer, Nick Labanok |
2018-11-13 |
$26,640,000 |
| 10008452 |
Microelectronic structures having laminated or embedded glass routing structures for high density packaging |
Qing Ma, Johanna M. Swan, John S. Guzek, Robert L. Sankman, Aleksandar Aleksov |
2018-06-26 |
$24,418,000 |
| 9832860 |
Panel level fabrication of package substrates with integrated stiffeners |
John S. Guzek, Patrick Nardi, Keith Jones, Javier Soto Gonzalez |
2017-11-28 |
$12,678,000 |
| 9679843 |
Localized high density substrate routing |
Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravindranath V. Mahajan |
2017-06-13 |
$8,497,000 |
| 9642248 |
Microelectronic structures having laminated or embedded glass routing structures for high density packaging |
Qing Ma, Johanna M. Swan, John S. Guzek, Robert L. Sankman, Aleksandar Aleksov |
2017-05-02 |
$12,076,000 |
| 9269701 |
Localized high density substrate routing |
Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan |
2016-02-23 |
$10,383,000 |
| 9136236 |
Localized high density substrate routing |
Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan |
2015-09-15 |
$17,844,000 |
| 9001520 |
Microelectronic structures having laminated or embedded glass routing structures for high density packaging |
Qing Ma, Johanna M. Swan, John S. Guzek, Robert L. Sankman, Aleksandar Aleksov |
2015-04-07 |
$25,687,000 |
| 8364304 |
Methods and apparatus for laser scribing wafers |
Andrew Proctor, Steve Terry |
2013-01-29 |
$10,118,000 |
| 7772090 |
Methods for laser scribing wafers |
Andrew Proctor, Steve Terry |
2010-08-10 |
$11,211,000 |
| 7332423 |
Soldering a die to a substrate |
Sridhar Narasimhan, Chia-Pin Chiu, Suzana Prstic, Patrick Neel Stover, Hong Xie |
2008-02-19 |
$15,849,000 |
| 7223638 |
Microelectronic assembly having a thermally conductive member with a cavity to contain a portion of a thermal interface material |
— |
2007-05-29 |
$13,871,000 |
| 7015592 |
Marking on underfill |
Jason Zhang |
2006-03-21 |
$17,683,000 |
