Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107042 | Localized high density substrate routing | Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan | 2024-10-01 |
| 11984396 | Localized high density substrate routing | Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan | 2024-05-14 |
| 11923257 | Hybrid microelectronic substrates | Robert L. Sankman, Scott M. Mokler, Richard C. Stamey, Amruthavalli Pallavi Alur | 2024-03-05 |
| 11515248 | Localized high density substrate routing | Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan | 2022-11-29 |
| 11444033 | Hybrid microelectronic substrate and methods for fabricating the same | Robert L. Sankman, Scott M. Mokler, Richard C. Stamey | 2022-09-13 |
| 11114353 | Hybrid microelectronic substrates | Robert L. Sankman, Scott M. Mokler, Richard C. Stamey, Amruthavalli Pallavi Alur | 2021-09-07 |
| 11022792 | Coupling a magnet with a MEMS device | Kyle Yazzie, Anna M. Prakash, Suriyakala Ramalingam, Liwei Wang, Arnab Choudhury +3 more | 2021-06-01 |
| 10796988 | Localized high density substrate routing | Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan | 2020-10-06 |
| 10763215 | Hybrid microelectronic substrate and methods for fabricating the same | Robert L. Sankman, Scott M. Mokler, Richard C. Stamey | 2020-09-01 |
| 10716214 | Hybrid microelectronic substrate and methods for fabricating the same | Richard C. Stamey, Robert L. Sankman, Scott M. Mokler | 2020-07-14 |
| 10366951 | Localized high density substrate routing | Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravindranath V. Mahajan | 2019-07-30 |
| 10304769 | Multi-die package | Robert L. Sankman, Allan A. Ovrom, III, Oren Arad | 2019-05-28 |
| 10125013 | Microelectromechanical system with spring for magnet placement | Amanuel M. Abebaw, Liwei Wang, Mark Saltas, Sandeep S. Iyer, Nick Labanok | 2018-11-13 |
| 10008452 | Microelectronic structures having laminated or embedded glass routing structures for high density packaging | Qing Ma, Johanna M. Swan, John S. Guzek, Robert L. Sankman, Aleksandar Aleksov | 2018-06-26 |
| 9832860 | Panel level fabrication of package substrates with integrated stiffeners | John S. Guzek, Patrick Nardi, Keith Jones, Javier Soto Gonzalez | 2017-11-28 |
| 9679843 | Localized high density substrate routing | Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravindranath V. Mahajan | 2017-06-13 |
| 9642248 | Microelectronic structures having laminated or embedded glass routing structures for high density packaging | Qing Ma, Johanna M. Swan, John S. Guzek, Robert L. Sankman, Aleksandar Aleksov | 2017-05-02 |
| 9269701 | Localized high density substrate routing | Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan | 2016-02-23 |
| 9136236 | Localized high density substrate routing | Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan | 2015-09-15 |
| 9001520 | Microelectronic structures having laminated or embedded glass routing structures for high density packaging | Qing Ma, Johanna M. Swan, John S. Guzek, Robert L. Sankman, Aleksandar Aleksov | 2015-04-07 |
| 8364304 | Methods and apparatus for laser scribing wafers | Andrew Proctor, Steve Terry | 2013-01-29 |
| 7772090 | Methods for laser scribing wafers | Andrew Proctor, Steve Terry | 2010-08-10 |
| 7332423 | Soldering a die to a substrate | Sridhar Narasimhan, Chia-Pin Chiu, Suzana Prstic, Patrick Neel Stover, Hong Xie | 2008-02-19 |
| 7223638 | Microelectronic assembly having a thermally conductive member with a cavity to contain a portion of a thermal interface material | — | 2007-05-29 |
| 7015592 | Marking on underfill | Jason Zhang | 2006-03-21 |