Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049971 | Package structure to enhance yield of TMI interconnections | Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Ashay Dani +6 more | 2018-08-14 |
| 9613933 | Package structure to enhance yield of TMI interconnections | Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Ashay Dani +6 more | 2017-04-04 |
| 7359211 | Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same | Juan Landeros, Lejun Wang | 2008-04-15 |
| 7218007 | Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices | Song Shi, Tian-An Chen, Katrina Certeza | 2007-05-15 |
| 7015592 | Marking on underfill | Robert Starkston | 2006-03-21 |