Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7218007 | Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices | Song Shi, Tian-An Chen, Jason Zhang | 2007-05-15 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7218007 | Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices | Song Shi, Tian-An Chen, Jason Zhang | 2007-05-15 |