Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7218007 | Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices | Song Shi, Tian-An Chen, Jason Zhang | 2007-05-15 | $17,522,000 |