{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices", "item": "https://www.patentleaderboard.com/patent/7218007"}]}

Home › Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices

Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices

US Patent 7218007 · Granted May 15, 2007

Estimated economic value: $17,522,000 ⓘ

Assignee

Intel

Inventors

Song Shi (39 patents)
Tian-An Chen (34 patents)
Jason Zhang (5 patents)
Katrina Certeza (1 patents)

View full patent text on Google Patents →