Via architecture for increased density interface

Assignee

• Intel

Inventors

• Aleksandar Aleksov (224 patents)
• Arnab Sarkar (28 patents)
• Arghya Sain (4 patents)
• Kristof Darmawikarta (102 patents)
• Henning Braunisch (119 patents)
• Prashant Parmar (2 patents)
• Sujit Sharan (199 patents)
• Johanna M. Swan (301 patents)
• Feras Eid (190 patents)

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