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Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial line |
Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more |
2023-10-17 |
| 11329358 |
Low loss and low cross talk transmission lines having l-shaped cross sections |
Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more |
2022-05-10 |
| 10651525 |
Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs |
Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more |
2020-05-12 |
| 10381291 |
Lithographacally defined vias for organic package substrate scaling |
Adel A. Elsherbini, Henning Braunisch, Brandon M. Rawlings, Aleksandar Aleksov, Feras Eid |
2019-08-13 |
| 9992859 |
Low loss and low cross talk transmission lines using shaped vias |
Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more |
2018-06-05 |
| 9049807 |
Processes of making pad-less interconnect for electrical coreless substrate |
Charan Gurumurthy, Robert M. Nickerson, Debendra Mallik |
2015-06-02 |
| 4958964 |
Semirigid floating pavement |
Domingo F. Llamas |
1990-09-25 |