Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791528 | Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial line | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more | 2023-10-17 |
| 11329358 | Low loss and low cross talk transmission lines having l-shaped cross sections | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more | 2022-05-10 |
| 10651525 | Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more | 2020-05-12 |
| 10381291 | Lithographacally defined vias for organic package substrate scaling | Adel A. Elsherbini, Henning Braunisch, Brandon M. Rawlings, Aleksandar Aleksov, Feras Eid | 2019-08-13 |
| 9992859 | Low loss and low cross talk transmission lines using shaped vias | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more | 2018-06-05 |
| 9049807 | Processes of making pad-less interconnect for electrical coreless substrate | Charan Gurumurthy, Robert M. Nickerson, Debendra Mallik | 2015-06-02 |
| 4958964 | Semirigid floating pavement | Domingo F. Llamas | 1990-09-25 |