Issued Patents All Time
Showing 26–50 of 186 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033914 | Package with thermal interface material retaining structures on die and heat spreader | — | 2024-07-09 |
| 12007170 | Thermal management in integrated circuit packages | Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov, Johanna M. Swan | 2024-06-11 |
| 12002745 | High performance integrated RF passives using dual lithography process | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, William J. Lambert, Robert L. Sankman +6 more | 2024-06-04 |
| 11990448 | Direct bonding in microelectronic assemblies | Adel A. Elsherbini, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan | 2024-05-21 |
| 11990419 | Physically unclonable function circuitry of a package substrate and method of providing same | Georgios Dogiamis, Adel A. Elsherbini, David Johnston, Jyothi Bhaskarr Velamala, Rachael Parker | 2024-05-21 |
| 11948906 | Hybrid backside thermal structures for enhanced IC packages | Joe Walczyk, Weihua Tang, Akhilesh Rallabandi, Marco Aurelio Cartas Ayala | 2024-04-02 |
| 11933555 | Heat dissipation device having anisotropic thermally conductive sections and isotropic thermally conductive sections | Adel A. Elsherbini, Johanna M. Swan | 2024-03-19 |
| 11895815 | Additive manufacturing for integrated circuit assembly cables | Georgios Dogiamis, Adel A. Elsherbini | 2024-02-06 |
| 11887944 | Additive manufacturing for integrated circuit assembly connectors | Georgios Dogiamis, Adel A. Elsherbini | 2024-01-30 |
| 11854932 | Package wrap-around heat spreader | Chandra Mohan Jha, Je-Young Chang | 2023-12-26 |
| 11842826 | Additive manufacturing for integrated circuit assembly connector support structures | Adel A. Elsherbini, Johanna M. Swan, Georgios Dogiamis | 2023-12-12 |
| 11830787 | Thermal management in integrated circuit packages | Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov, Johanna M. Swan | 2023-11-28 |
| 11823972 | Thermal management solutions that reduce inductive coupling between stacked integrated circuit devices | Adel A. Elsherbini, Johanna M. Swan | 2023-11-21 |
| 11791528 | Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial line | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more | 2023-10-17 |
| 11784181 | Die backend diodes for electrostatic discharge (ESD) protection | Aleksandar Aleksov, Adel A. Elsherbini, Veronica Strong, Johanna M. Swan | 2023-10-10 |
| 11784108 | Thermal management in integrated circuit packages | Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov, Johanna M. Swan | 2023-10-10 |
| 11776869 | Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense | Johanna M. Swan, Sergio Antonio Chan Arguedas, John J. Beatty | 2023-10-03 |
| 11751367 | Microelectronic package electrostatic discharge (ESD) protection | Veronica Strong, Johanna M. Swan, Aleksandar Aleksov, Adel A. Elsherbini | 2023-09-05 |
| 11694962 | Microelectronic package with mold-integrated components | Georgios Dogiamis, Aleksandar Aleksov, Telesphor Kamgaing, Johanna M. Swan | 2023-07-04 |
| 11688665 | Thermal management solutions for stacked integrated circuit devices | Adel A. Elsherbini, Johanna M. Swan | 2023-06-27 |
| 11688660 | Bridge for radio frequency (RF) multi-chip modules | Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Johanna M. Swan | 2023-06-27 |
| 11676918 | Electrostatic discharge protection in integrated circuits | Adel A. Elsherbini, Johanna M. Swan, Aleksandar Aleksov, Veronica Strong | 2023-06-13 |
| 11658418 | Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems | Sasha N. Oster, Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov | 2023-05-23 |
| 11652074 | Semiconductor package with improved thermal blocks | Johanna M. Swan | 2023-05-16 |
| 11641711 | Microelectronic package with substrate-integrated components | Georgios Dogiamis, Aleksandar Aleksov, Telesphor Kamgaing, Johanna M. Swan | 2023-05-02 |