| 12062631 |
Microelectronic assemblies with inductors in direct bonding regions |
Adel A. Elsherbini, Krishna Bharath, Kevin P. O'Brien, Kimin Jun, Han Wui Then +5 more |
2024-08-13 |
$26,861,000 |
| 12057402 |
Direct bonding in microelectronic assemblies |
Aleksandar Aleksov, Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan, Randy B. Osborne +1 more |
2024-08-06 |
$17,070,000 |
| 12040776 |
Integrated radio frequency (RF) front-end module (FEM) |
Telesphor Kamgaing, Aleksandar Aleksov, Georgios Dogiamis, Johanna M. Swan |
2024-07-16 |
$26,089,000 |
| 12040307 |
Magnetic induced heating for solder interconnects |
Adel A. Elsherbini, Georgios Dogiamis |
2024-07-16 |
$26,089,000 |
| 12033914 |
Package with thermal interface material retaining structures on die and heat spreader |
— |
2024-07-09 |
$24,938,000 |
| 12007170 |
Thermal management in integrated circuit packages |
Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov, Johanna M. Swan |
2024-06-11 |
$21,221,000 |
| 12002745 |
High performance integrated RF passives using dual lithography process |
Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, William J. Lambert, Robert L. Sankman +6 more |
2024-06-04 |
$24,500,000 |
| 11990419 |
Physically unclonable function circuitry of a package substrate and method of providing same |
Georgios Dogiamis, Adel A. Elsherbini, David Johnston, Jyothi Bhaskarr Velamala, Rachael Parker |
2024-05-21 |
$18,840,000 |
| 11990448 |
Direct bonding in microelectronic assemblies |
Adel A. Elsherbini, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan |
2024-05-21 |
$18,840,000 |
| 11948906 |
Hybrid backside thermal structures for enhanced IC packages |
Joe Walczyk, Weihua Tang, Akhilesh Rallabandi, Marco Aurelio Cartas Ayala |
2024-04-02 |
$34,819,000 |
| 11933555 |
Heat dissipation device having anisotropic thermally conductive sections and isotropic thermally conductive sections |
Adel A. Elsherbini, Johanna M. Swan |
2024-03-19 |
$28,784,000 |
| 11895815 |
Additive manufacturing for integrated circuit assembly cables |
Georgios Dogiamis, Adel A. Elsherbini |
2024-02-06 |
$35,892,000 |
| 11887944 |
Additive manufacturing for integrated circuit assembly connectors |
Georgios Dogiamis, Adel A. Elsherbini |
2024-01-30 |
$30,721,000 |
| 11854932 |
Package wrap-around heat spreader |
Chandra Mohan Jha, Je-Young Chang |
2023-12-26 |
$39,948,000 |
| 11842826 |
Additive manufacturing for integrated circuit assembly connector support structures |
Adel A. Elsherbini, Johanna M. Swan, Georgios Dogiamis |
2023-12-12 |
$45,136,000 |
| 11830787 |
Thermal management in integrated circuit packages |
Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov, Johanna M. Swan |
2023-11-28 |
$31,872,000 |
| 11823972 |
Thermal management solutions that reduce inductive coupling between stacked integrated circuit devices |
Adel A. Elsherbini, Johanna M. Swan |
2023-11-21 |
$28,968,000 |
| 11791528 |
Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial line |
Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more |
2023-10-17 |
$15,641,000 |
| 11784108 |
Thermal management in integrated circuit packages |
Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov, Johanna M. Swan |
2023-10-10 |
$20,947,000 |
| 11784181 |
Die backend diodes for electrostatic discharge (ESD) protection |
Aleksandar Aleksov, Adel A. Elsherbini, Veronica Strong, Johanna M. Swan |
2023-10-10 |
$20,947,000 |
| 11776869 |
Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense |
Johanna M. Swan, Sergio Antonio Chan Arguedas, John J. Beatty |
2023-10-03 |
$24,984,000 |
| 11751367 |
Microelectronic package electrostatic discharge (ESD) protection |
Veronica Strong, Johanna M. Swan, Aleksandar Aleksov, Adel A. Elsherbini |
2023-09-05 |
$19,899,000 |
| 11694962 |
Microelectronic package with mold-integrated components |
Georgios Dogiamis, Aleksandar Aleksov, Telesphor Kamgaing, Johanna M. Swan |
2023-07-04 |
|
| 11688665 |
Thermal management solutions for stacked integrated circuit devices |
Adel A. Elsherbini, Johanna M. Swan |
2023-06-27 |
$18,721,000 |
| 11688660 |
Bridge for radio frequency (RF) multi-chip modules |
Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Johanna M. Swan |
2023-06-27 |
$18,721,000 |
