Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12414269 | Interleaved heterogeneous heat pipes with different Qmax | Gaurav Patankar, Ruander Cardenas, Mark MacDonald | 2025-09-09 |
| 11972303 | Methods, apparatus, and systems to dynamically schedule workloads among compute resources based on temperature | Carin Ruiz, Bo Qiu, Columbia Mishra, Arijit Chattopadhyay, Chee Lim Nge +6 more | 2024-04-30 |
| 11948906 | Hybrid backside thermal structures for enhanced IC packages | Feras Eid, Joe Walczyk, Weihua Tang, Marco Aurelio Cartas Ayala | 2024-04-02 |
| 11251103 | Segmented heatsink | Jerrod Peterson, Carin Ruiz | 2022-02-15 |
| 10281521 | System for thermal management of device under test (DUT) | David W. Song, James Hastings, Morten S. Jensen, Christopher Wade Ackerman, Christopher R. Schroeder +2 more | 2019-05-07 |