Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11963335 | Heatsink with a sandwich plate construction | Juha Paavola, Justin Huttula, Ellann Cohen, Ruander Cardenas | 2024-04-16 |
| 11679407 | Liquid metal thermal interface material application | Kyle Arrington, Joseph Petrini, Aaron McCann, Shankar Devasenathipathy, James C. Matayabas, Jr. +1 more | 2023-06-20 |
| 11616000 | Methods and apparatus to provide electrical shielding for integrated circuit packages using a thermal interface material | Dong-Ho Han, Jaejin Lee, Kyle Arrington | 2023-03-28 |
| 11545410 | Enhanced systems and methods for improved heat transfer from semiconductor packages | Mark MacDonald, David Pidwerbecki, Mark Gallina | 2023-01-03 |
| 11251103 | Segmented heatsink | Carin Ruiz, Akhilesh Rallabandi | 2022-02-15 |
| 11081450 | Radiation shield around a component on a substrate | Dong-Ho Han, Jaejin Lee, Je-Young Chang, Mark Carbone | 2021-08-03 |
| 10880986 | Activate loading mechanism | Evan Piotr Kuklinski, Ruander Cardenas, Patrick Douglas James | 2020-12-29 |
| 10804168 | Induced warpage of a thermal conductor | David Pidwerbecki | 2020-10-13 |
| 10418291 | Induced warpage of a thermal conductor | David Pidwerbecki | 2019-09-17 |