| 12505065 |
On-package die-to-die (D2D) interconnect for memory using universal chiplet interconnect express (UCIe) PHY |
Debendra Das Sharma, Narasimha Lanka, Peter Z. Onufryk, Swadesh Choudhary, Zuoguo Wu +2 more |
2025-12-23 |
|
| 12500583 |
Clock interpolation system for eye-centering |
Jayen Desai, Pengyin WANG, Debendra Das Sharma |
2025-12-16 |
|
| 12499074 |
Die-to-die interconnect protocol layer |
Debendra Das Sharma, Swadesh Choudhary, Narasimha Lanka, Lakshmi Narasimhan Seshan, Zuoguo Wu |
2025-12-16 |
|
| 12499019 |
Retimers to extend a die-to-die interconnect |
Debendra Das Sharma, Swadesh Choudhary, Sridhar Muthrasanallur, Narasimha Lanka, Zuoguo Wu +1 more |
2025-12-16 |
|
| 12481614 |
Standard interfaces for die to die (D2D) interconnect stacks |
Debendra Das Sharma, Swadesh Choudhary, Narasimha Lanka, Zuoguo Wu, Lakshmi Narasimhan Seshan |
2025-11-25 |
|
| 12468597 |
Valid signal for latency sensitive die-to-die (D2D) interconnects |
Narasimha Lanka, Debendra Das Sharma, Lakshmi Narasimhan Seshan, Swadesh Choudhary, Zuoguo Wu |
2025-11-11 |
|
| 12469820 |
Fine-grained disaggregated server architecture |
Carleton L. Molnar, Adel A. Elsherbini, Tanay Karnik, Shawna M. Liff, Robert J. Munoz +6 more |
2025-11-11 |
|
| 12405912 |
Link initialization training and bring up for die-to-die interconnect |
Narasimha Lanka, Lakshmipriya Seshan, Swadesh Choudhary, Debendra Das Sharma, Zuoguo Wu |
2025-09-02 |
|
| 12406962 |
Power delivery through capacitor-dies in a multi-layered microelectronic assembly |
Adel A. Elsherbini, William J. Lambert, Krishna Bharath, Shawna M. Liff, Nicolas Butzen +4 more |
2025-09-02 |
|
| 12362284 |
Composite interposer structure and method of providing same |
Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan |
2025-07-15 |
|
| 12362306 |
Clock-gating in die-to-die (D2D) interconnects |
Narasimha Lanka, Debendra Das Sharma, Lakshmipriya Seshan, Zuoguo Wu, Swadesh Choudhary |
2025-07-15 |
|
| 12353305 |
Compliance and debug testing of a die-to-die interconnect |
Swadesh Choudhary, Narasimha Lanka, Debendra Das Sharma, Lakshmipriya Seshan, Zuoguo Wu |
2025-07-08 |
|
| 12332826 |
Die-to-die interconnect |
Debendra Das Sharma, Swadesh Choudhary, Narasimha Lanka, Lakshmipriya Seshan, Zuoguo Wu |
2025-06-17 |
|
| 12321305 |
Sideband interface for die-to-die interconnects |
Narasimha Lanka, Swadesh Choudhary, Debendra Das Sharma, Lakshmipriya Seshan, Zuoguo Wu |
2025-06-03 |
|
| 12316343 |
PHY-based retry techniques for die-to-die interfaces |
Narasimha Lanka, Lakshmipriya Seshan, Debendra Das Sharma, Zuoguo Wu |
2025-05-27 |
|
| 12315794 |
Skip level vias in metallization layers for integrated circuit devices |
Adel A. Elsherbini, Mauro J. Kobrinsky, Shawna M. Liff, Johanna M. Swan, Sathya Narasimman Tiagaraj |
2025-05-27 |
|
| 12306216 |
Dynamic voltage regulator sensing for chiplet-based designs |
Vikrant Thigle, Vijay Anand Mathiyalagan, Anand Haridass, Arun Chandrasekhar |
2025-05-20 |
|
| 12288746 |
Skip level vias in metallization layers for integrated circuit devices |
Adel A. Elsherbini, Mauro J. Kobrinsky, Shawna M. Liff, Johanna M. Swan, Sathya Narasimman Tiagaraj |
2025-04-29 |
|
| 12266682 |
Capacitors and resistors at direct bonding interfaces in microelectronic assemblies |
Adel A. Elsherbini, Mohammad Enamul Kabir, Zhiguo Qian, Kimin Jun, Shawna M. Liff +3 more |
2025-04-01 |
|
| 12164319 |
Dual loop voltage regulator |
Sathya Narasimman Tiagaraj, Edward A. Burton |
2024-12-10 |
$13,394,000 |
| 12159840 |
Scalable and interoperable PHYLESS die-to-die IO solution |
Zhiguo Qian, Juan Zeng, Peipei Wang, Ahmad Siddiqui, Lakshmipriya Seshan |
2024-12-03 |
$28,395,000 |
| 12117960 |
Approximate data bus inversion technique for latency sensitive applications |
Narasimha Lanka, Lakshmipriya Seshan, Zuoguo Wu |
2024-10-15 |
$19,078,000 |
| 12107060 |
Microelectronic assemblies with inductors in direct bonding regions |
Adel A. Elsherbini, Zhiguo Qian, Mohammad Enamul Kabir, Han Wui Then, Kimin Jun +5 more |
2024-10-01 |
$20,560,000 |
| 12100662 |
Power-forwarding bridge for inter-chip data signal transfer |
Zhiguo Qian, Peipei Wang, Daniel Scott Krueger, Edward A. Burton |
2024-09-24 |
$33,787,000 |
| 12062631 |
Microelectronic assemblies with inductors in direct bonding regions |
Adel A. Elsherbini, Krishna Bharath, Kevin P. O'Brien, Kimin Jun, Han Wui Then +5 more |
2024-08-13 |
$26,861,000 |
