Issued Patents All Time
Showing 25 most recent of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406962 | Power delivery through capacitor-dies in a multi-layered microelectronic assembly | Adel A. Elsherbini, William J. Lambert, Krishna Bharath, Shawna M. Liff, Nicolas Butzen +4 more | 2025-09-02 |
| 12405912 | Link initialization training and bring up for die-to-die interconnect | Narasimha Lanka, Lakshmipriya Seshan, Swadesh Choudhary, Debendra Das Sharma, Zuoguo Wu | 2025-09-02 |
| 12362284 | Composite interposer structure and method of providing same | Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan | 2025-07-15 |
| 12362306 | Clock-gating in die-to-die (D2D) interconnects | Narasimha Lanka, Debendra Das Sharma, Lakshmipriya Seshan, Zuoguo Wu, Swadesh Choudhary | 2025-07-15 |
| 12353305 | Compliance and debug testing of a die-to-die interconnect | Swadesh Choudhary, Narasimha Lanka, Debendra Das Sharma, Lakshmipriya Seshan, Zuoguo Wu | 2025-07-08 |
| 12332826 | Die-to-die interconnect | Debendra Das Sharma, Swadesh Choudhary, Narasimha Lanka, Lakshmipriya Seshan, Zuoguo Wu | 2025-06-17 |
| 12321305 | Sideband interface for die-to-die interconnects | Narasimha Lanka, Swadesh Choudhary, Debendra Das Sharma, Lakshmipriya Seshan, Zuoguo Wu | 2025-06-03 |
| 12316343 | PHY-based retry techniques for die-to-die interfaces | Narasimha Lanka, Lakshmipriya Seshan, Debendra Das Sharma, Zuoguo Wu | 2025-05-27 |
| 12315794 | Skip level vias in metallization layers for integrated circuit devices | Adel A. Elsherbini, Mauro J. Kobrinsky, Shawna M. Liff, Johanna M. Swan, Sathya Narasimman Tiagaraj | 2025-05-27 |
| 12306216 | Dynamic voltage regulator sensing for chiplet-based designs | Vikrant Thigle, Vijay Anand Mathiyalagan, Anand Haridass, Arun Chandrasekhar | 2025-05-20 |
| 12288746 | Skip level vias in metallization layers for integrated circuit devices | Adel A. Elsherbini, Mauro J. Kobrinsky, Shawna M. Liff, Johanna M. Swan, Sathya Narasimman Tiagaraj | 2025-04-29 |
| 12266682 | Capacitors and resistors at direct bonding interfaces in microelectronic assemblies | Adel A. Elsherbini, Mohammad Enamul Kabir, Zhiguo Qian, Kimin Jun, Shawna M. Liff +3 more | 2025-04-01 |
| 12164319 | Dual loop voltage regulator | Sathya Narasimman Tiagaraj, Edward A. Burton | 2024-12-10 |
| 12159840 | Scalable and interoperable PHYLESS die-to-die IO solution | Zhiguo Qian, Juan Zeng, Peipei Wang, Ahmad Siddiqui, Lakshmipriya Seshan | 2024-12-03 |
| 12117960 | Approximate data bus inversion technique for latency sensitive applications | Narasimha Lanka, Lakshmipriya Seshan, Zuoguo Wu | 2024-10-15 |
| 12107060 | Microelectronic assemblies with inductors in direct bonding regions | Adel A. Elsherbini, Zhiguo Qian, Mohammad Enamul Kabir, Han Wui Then, Kimin Jun +5 more | 2024-10-01 |
| 12100662 | Power-forwarding bridge for inter-chip data signal transfer | Zhiguo Qian, Peipei Wang, Daniel Scott Krueger, Edward A. Burton | 2024-09-24 |
| 12062631 | Microelectronic assemblies with inductors in direct bonding regions | Adel A. Elsherbini, Krishna Bharath, Kevin P. O'Brien, Kimin Jun, Han Wui Then +5 more | 2024-08-13 |
| 12014990 | Composite interposer structure and method of providing same | Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan | 2024-06-18 |
| 11899615 | Multiple dies hardware processors and methods | Nevine Nassif, Yen-Cheng Liu, Krishnakanth V. Sistla, Siva Soumya Eachempati, Tejpal Singh +10 more | 2024-02-13 |
| 11749649 | Composite IC chips including a chiplet embedded within metallization layers of a host IC chip | Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Patrick Morrow, Van H. Le | 2023-09-05 |
| 11694986 | Vias in composite IC chip structures | Adel A. Elsherbini, Patrick Morrow, Johanna M. Swan, Shawna M. Liff, Mauro Kobrinksy +1 more | 2023-07-04 |
| 11652059 | Composite interposer structure and method of providing same | Adel A. Elsherbini, Shawna M. Lift, Johanna M. Swan | 2023-05-16 |
| 11586579 | Multiple dies hardware processors and methods | Nevine Nassif, Yen-Cheng Liu, Krishnakanth V. Sistla, Siva Soumya Eachempati, Tejpal Singh +10 more | 2023-02-21 |
| 11581282 | Serializer-deserializer die for high speed signal interconnect | Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff | 2023-02-14 |