Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12163982 | Microbump cluster probing architecture for 2.5D and 3D dies | Jagat Shakya, Ethan Caughey | 2024-12-10 |
| 11740282 | Apparatuses and methods for monitoring health of probing u-bump cluster using current divider | Jagat Shakya, Ethan Caughey, Ashwin Ashok, Prasanna Thiyagasundaram | 2023-08-29 |
| 10429439 | In die stepping sort | Dae-Woo Kim, J. Daniel Bryan, Ethan Caughey, Mark W. Dryfuse | 2019-10-01 |
| 6410359 | Reduced leakage trench isolation | Kevin M. Connolly, Jung Kang, Berni W. Landau, James Breisch, Akira Kakizawa +4 more | 2002-06-25 |
| 6215165 | Reduced leakage trench isolation | Kevin M. Connolly, Jung Kang, Berni W. Landau, James Breisch, Akira Kakizawa +4 more | 2001-04-10 |