Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12163982 | Microbump cluster probing architecture for 2.5D and 3D dies | Jagat Shakya, Ethan Caughey | 2024-12-10 | $13,394,000 |
| 11740282 | Apparatuses and methods for monitoring health of probing u-bump cluster using current divider | Jagat Shakya, Ethan Caughey, Ashwin Ashok, Prasanna Thiyagasundaram | 2023-08-29 | $19,273,000 |
| 10429439 | In die stepping sort | Dae-Woo Kim, J. Daniel Bryan, Ethan Caughey, Mark W. Dryfuse | 2019-10-01 | $22,201,000 |
| 6410359 | Reduced leakage trench isolation | Kevin M. Connolly, Jung Kang, Berni W. Landau, James Breisch, Akira Kakizawa +4 more | 2002-06-25 | $55,737,000 |
| 6215165 | Reduced leakage trench isolation | Kevin M. Connolly, Jung Kang, Berni W. Landau, James Breisch, Akira Kakizawa +4 more | 2001-04-10 | $109,826,000 |