Issued Patents All Time
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381291 | Lithographacally defined vias for organic package substrate scaling | Adel A. Elsherbini, Henning Braunisch, Aleksandar Aleksov, Feras Eid, Javier Soto | 2019-08-13 |
| 10263312 | Plurality of dielectric waveguides including dielectric waveguide cores for connecting first and second server boards | Sasha N. Oster, Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Adel A. Elsherbini +3 more | 2019-04-16 |
| 10249925 | Dielectric waveguide bundle including a supporting feature for connecting first and second server boards | Georgios Dogiamis, Sasha N. Oster, Telesphor Kamgaing, Adel A. Elsherbini, Johanna M. Swan +3 more | 2019-04-02 |
| 10187998 | Zero-misalignment via-pad structures | Henning Braunisch | 2019-01-22 |
| 10083923 | Platform with thermally stable wireless interconnects | Georgios Dogiamis, Sasha N. Oster, Telesphor Kamgaing, Adel A. Elsherbini, Feras Eid | 2018-09-25 |
| 9713264 | Zero-misalignment via-pad structures | Henning Braunisch | 2017-07-18 |