Issued Patents All Time
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11296040 | Electrostatic discharge protection in integrated circuits | Adel A. Elsherbini, Feras Eid, Johanna M. Swan, Aleksandar Aleksov | 2022-04-05 |
| 11289431 | Electrostatic discharge protection in integrated circuits using materials with optically controlled electrical conductivity | Feras Eid, Aleksandar Aleksov, Adel A. Elsherbini, Johanna M. Swan | 2022-03-29 |
| 11264373 | Die backend diodes for electrostatic discharge (ESD) protection | Aleksandar Aleksov, Adel A. Elsherbini, Feras Eid, Johanna M. Swan | 2022-03-01 |
| 11257632 | Capacitor with electrodes made of an interconnected corrugated carbon-based network | Maher F. El-Kady, Richard B. Kaner | 2022-02-22 |
| 11257745 | Electroless metal-defined thin pad first level interconnects for lithographically defined vias | Aleksandar Aleksov, Kristof Darmawikarta, Arnab Sarkar | 2022-02-22 |
| 11239155 | Conductive contact structures for electrostatic discharge protection in integrated circuits | Adel A. Elsherbini, Feras Eid, Johanna M. Swan, Aleksandar Aleksov | 2022-02-01 |
| 11222836 | Zero-misalignment two-via structures | Aleksandar Aleksov, Brandon M. Rawlings, Johanna M. Swan | 2022-01-11 |
| 11222856 | Package-integrated bistable switch for electrostatic discharge (ESD) protection | Feras Eid, Aleksandar Aleksov, Adel A. Elsherbini, Johanna M. Swan | 2022-01-11 |
| 11189580 | Electrostatic discharge protection in integrated circuits | Adel A. Elsherbini, Krishna Bharath, Feras Eid, Johanna M. Swan, Aleksandar Aleksov | 2021-11-30 |
| 11147197 | Microelectronic package electrostatic discharge (ESD) protection | Johanna M. Swan, Aleksandar Aleksov, Adel A. Elsherbini, Feras Eid | 2021-10-12 |
| 11133263 | High-density interconnects for integrated circuit packages | Aleksandar Aleksov, Henning Braunisch, Brandon M. Rawlings, Johanna M. Swan, Shawna M. Liff | 2021-09-28 |
| 11101205 | Interconnection structure fabrication using grayscale lithography | Johanna M. Swan, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Brandon M. Rawlings | 2021-08-24 |
| 11049791 | Heat spreading layer integrated within a composite IC die structure and methods of forming the same | Shawna M. Liff, Adel A. Elsherbini, Johanna M. Swan, Jimin Yao | 2021-06-29 |
| 11004618 | Capacitor with electrodes made of an interconnected corrugated carbon-based network | Maher F. El-Kady, Richard B. Kaner | 2021-05-11 |
| 10998272 | Organic interposers for integrated circuit packages | Aleksandar Aleksov, Henning Braunisch, Shawna M. Liff, Brandon M. Rawlings, Johanna M. Swan | 2021-05-04 |
| 10648958 | Interconnected corrugated carbon-based network | Maher F. El-Kady, Richard B. Kaner | 2020-05-12 |
| 10629557 | Improving mechanical and thermal reliability in varying form factors | Sasha N. Oster, Shawna M. Liff | 2020-04-21 |
| 10418605 | Embedded formation of wearable and flexible batteries | Sasha N. Oster, Feras Eid, Aranzazu MAESTRE CARO | 2019-09-17 |
| 9779884 | Capacitor with electrodes made of an interconnected corrugated carbon-based network | Maher F. El-Kady, Richard B. Kaner | 2017-10-03 |