Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334422 | Methods and apparatus to reduce defects in interconnects between semicondcutor dies and package substrates | Kyle McElhinny, Onur Ozkan, Xiaoying Guo, Steve Cho, Leonel Arana +4 more | 2025-06-17 |
| 11935857 | Surface finishes with low RBTV for fine and mixed bump pitch architectures | Kristof Darmawaikarta, Robert Alan May, Sashi S. Kandanur, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram +7 more | 2024-03-19 |
| 11699648 | Electromigration resistant and profile consistent contact arrays | Srinivas V. Pietambaram, Jung Kyu Han, Steve Cho, Thomas HEATON, Hiroki Tanaka +3 more | 2023-07-11 |
| 11488918 | Surface finishes with low rBTV for fine and mixed bump pitch architectures | Kristof Darmawaikarta, Robert Alan May, Sashi S. Kandanur, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram +7 more | 2022-11-01 |
| 11309239 | Electromigration resistant and profile consistent contact arrays | Srinivas V. Pietambaram, Jung Kyu Han, Steve Cho, Thomas HEATON, Hiroki Tanaka +3 more | 2022-04-19 |
| 10854541 | Electromigration resistant and profile consistent contact arrays | Srinivas V. Pietambaram, Jung Kyu Han, Steve Cho, Thomas HEATON, Hiroki Tanaka +3 more | 2020-12-01 |
| 10431537 | Electromigration resistant and profile consistent contact arrays | Srinivas V. Pietambaram, Jung Kyu Han, Steve Cho, Thomas HEATON, Hiroki Tanaka +3 more | 2019-10-01 |