| 12416093 |
Electroless plating process |
Chandrasekharan Nair, Rengarajan Shanmugam, Srinivasan Raman, Roy Dittler, Daniel Sowa +3 more |
2025-09-16 |
| 12399006 |
Agitation monitoring system for plating process |
Adrian BAYRAKTAROGLU, David B. Lampner |
2025-08-26 |
| 12349282 |
Capacitors in through glass vias |
Benjamin Duong, Aleksandar Aleksov, Helme A. CASTRO DE LA TORRE, Kristof Darmawikarta, Sashi S. Kandanur +5 more |
2025-07-01 |
| 12159844 |
Electronic substrates having embedded inductors |
Benjamin Duong, Roy Dittler, Chandrasekharan Nair, Rengarajan Shanmugam |
2024-12-03 |
| 12159825 |
Dielectric-to-metal adhesion promotion material |
Rahul N. Manepalli, Suddhasattwa Nad, Marcel Wall |
2024-12-03 |
| 12057252 |
Electronic substrates having embedded inductors |
Benjamin Duong, Michael Garelick, Tarek A. Ibrahim, Brandon C. Marin, Sai Vadlamani +1 more |
2024-08-06 |
| 11791228 |
Method for forming embedded grounding planes on interconnect layers |
Brandon C. Marin, Kristof Darmawikarta, Roy Dittler, Jeremy Ecton |
2023-10-17 |
| 11728265 |
Selective deposition of embedded thin-film resistors for semiconductor packaging |
Brandon C. Marin, Frank Truong, Shivasubramanian Balasubramanian, Dilan Seneviratne, Yonggang Li +4 more |
2023-08-15 |
| 11574993 |
Package architecture with tunable magnetic properties for embedded devices |
Rengarajan Shanmugam, Suddhasattwa Nad, Srinivas V. Pietambaram |
2023-02-07 |
| 11501967 |
Selective metal deposition by patterning direct electroless metal plating |
Suddhasattwa Nad, Roy Dittler, Marcel Wall, Rahul N. Manepalli |
2022-11-15 |
| 11291122 |
Apparatus with a substrate provided with plasma treatment |
Rengarajan Shanmugam, Sandeep Gaan, Adrian BAYRAKTAROGLU, Roy Dittler, Ke-Tien Liu +4 more |
2022-03-29 |