Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12416093 | Electroless plating process | Chandrasekharan Nair, Rengarajan Shanmugam, Srinivasan Raman, Roy Dittler, Daniel Sowa +3 more | 2025-09-16 |
| 12399006 | Agitation monitoring system for plating process | Adrian BAYRAKTAROGLU, David B. Lampner | 2025-08-26 |
| 12349282 | Capacitors in through glass vias | Benjamin Duong, Aleksandar Aleksov, Helme A. CASTRO DE LA TORRE, Kristof Darmawikarta, Sashi S. Kandanur +5 more | 2025-07-01 |
| 12159844 | Electronic substrates having embedded inductors | Benjamin Duong, Roy Dittler, Chandrasekharan Nair, Rengarajan Shanmugam | 2024-12-03 |
| 12159825 | Dielectric-to-metal adhesion promotion material | Rahul N. Manepalli, Suddhasattwa Nad, Marcel Wall | 2024-12-03 |
| 12057252 | Electronic substrates having embedded inductors | Benjamin Duong, Michael Garelick, Tarek A. Ibrahim, Brandon C. Marin, Sai Vadlamani +1 more | 2024-08-06 |
| 11791228 | Method for forming embedded grounding planes on interconnect layers | Brandon C. Marin, Kristof Darmawikarta, Roy Dittler, Jeremy Ecton | 2023-10-17 |
| 11728265 | Selective deposition of embedded thin-film resistors for semiconductor packaging | Brandon C. Marin, Frank Truong, Shivasubramanian Balasubramanian, Dilan Seneviratne, Yonggang Li +4 more | 2023-08-15 |
| 11574993 | Package architecture with tunable magnetic properties for embedded devices | Rengarajan Shanmugam, Suddhasattwa Nad, Srinivas V. Pietambaram | 2023-02-07 |
| 11501967 | Selective metal deposition by patterning direct electroless metal plating | Suddhasattwa Nad, Roy Dittler, Marcel Wall, Rahul N. Manepalli | 2022-11-15 |
| 11291122 | Apparatus with a substrate provided with plasma treatment | Rengarajan Shanmugam, Sandeep Gaan, Adrian BAYRAKTAROGLU, Roy Dittler, Ke-Tien Liu +4 more | 2022-03-29 |