Issued Patents All Time
Showing 51–75 of 215 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784108 | Thermal management in integrated circuit packages | Feras Eid, Telesphor Kamgaing, Georgios Dogiamis, Johanna M. Swan | 2023-10-10 |
| 11769734 | Microelectronic assemblies | Johanna M. Swan | 2023-09-26 |
| 11756948 | In situ package integrated thin film capacitors for power delivery | Thomas L. Sounart, Henning Braunisch | 2023-09-12 |
| 11751367 | Microelectronic package electrostatic discharge (ESD) protection | Veronica Strong, Johanna M. Swan, Adel A. Elsherbini, Feras Eid | 2023-09-05 |
| 11728258 | Electroless metal-defined thin pad first level interconnects for lithographically defined vias | Veronica Strong, Kristof Darmawikarta, Arnab Sarkar | 2023-08-15 |
| 11728290 | Waveguide fan-out | Adel A. Elsherbini, Georgios Dogiamis, Johanna M. Swan, Telesphor Kamgaing, Henning Braunisch | 2023-08-15 |
| 11721650 | Method for fabricating multiplexed hollow waveguides of variable type on a semiconductor package | Brandon C. Marin, Georgios Dogiamis, Jeremy Ecton, Suddhasattwa Nad, Mohammad Mamunur Rahman | 2023-08-08 |
| 11716826 | Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device | Telesphor Kamgaing, Johanna M. Swan, Georgios Dogiamis, Henning Braunisch, Adel A. Elsherbini +1 more | 2023-08-01 |
| 11715693 | Dielectric waveguide channel for interconnecting dies in a semiconductor package usable in a computing device and method of manufacture | Georgios Dogiamis, Adel A. Elsherbini, Henning Braunisch, Johanna M. Swan, Telesphor Kamgaing | 2023-08-01 |
| 11694962 | Microelectronic package with mold-integrated components | Georgios Dogiamis, Feras Eid, Telesphor Kamgaing, Johanna M. Swan | 2023-07-04 |
| 11694951 | Zero-misalignment two-via structures | Veronica Strong, Brandon M. Rawlings, Johanna M. Swan | 2023-07-04 |
| 11688660 | Bridge for radio frequency (RF) multi-chip modules | Feras Eid, Georgios Dogiamis, Telesphor Kamgaing, Johanna M. Swan | 2023-06-27 |
| 11676918 | Electrostatic discharge protection in integrated circuits | Adel A. Elsherbini, Feras Eid, Johanna M. Swan, Veronica Strong | 2023-06-13 |
| 11664303 | Interconnection structure fabrication using grayscale lithography | Johanna M. Swan, Henning Braunisch, Shawna M. Liff, Brandon M. Rawlings, Veronica Strong | 2023-05-30 |
| 11658418 | Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems | Feras Eid, Sasha N. Oster, Telesphor Kamgaing, Georgios Dogiamis | 2023-05-23 |
| 11641711 | Microelectronic package with substrate-integrated components | Georgios Dogiamis, Feras Eid, Telesphor Kamgaing, Johanna M. Swan | 2023-05-02 |
| 11621236 | Electrostatic discharge protection in integrated circuits using positive temperature coefficient material | Feras Eid, Veronica Strong, Adel A. Elsherbini, Johanna M. Swan | 2023-04-04 |
| 11621192 | Inorganic dies with organic interconnect layers and related structures | Feras Eid, Telesphor Kamgaing, Georgios Dogiamis, Johanna M. Swan | 2023-04-04 |
| 11605603 | Microelectronic package with radio frequency (RF) chiplet | Adel A. Elsherbini, Georgios Dogiamis, Telesphor Kamgaing, Henning Braunisch, Johanna M. Swan +1 more | 2023-03-14 |
| 11605867 | Fabricating an RF filter on a semiconductor package using selective seeding | Brandon C. Marin, Jeremy Ecton, Kristof Darmawikarta, Yonggang Li, Dilan Seneviratne | 2023-03-14 |
| 11538803 | Integration of III-V transistors in a silicon CMOS stack | Gilbert Dewey, Telesphor Kamgaing, Gerogios Dogiamis, Hyung-Jin Lee | 2022-12-27 |
| 11532574 | Through-substrate waveguide | Georgios Dogiamis, Telesphor Kamgaing, Gilbert Dewey, Hyung-Jin Lee | 2022-12-20 |
| 11532584 | Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling | Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Srinivas V. Pietambaram, Javier Soto Gonzalez +1 more | 2022-12-20 |
| 11502037 | Zero-misalignment two-via structures using photoimageable dielectric, buildup film, and electrolytic plating | Veronica Strong, Brandon M. Rawlings | 2022-11-15 |
| 11495552 | Substrate integrated thin film capacitors using amorphous high-k dielectrics | Thomas L. Sounart, Kristof Darmawikarta, Henning Braunisch, Prithwish Chatterjee, Andrew J. Brown | 2022-11-08 |