Issued Patents All Time
Showing 76–100 of 215 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488918 | Surface finishes with low rBTV for fine and mixed bump pitch architectures | Kristof Darmawaikarta, Robert Alan May, Sashi S. Kandanur, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram +7 more | 2022-11-01 |
| 11462480 | Microelectronic assemblies having interposers | Johanna M. Swan | 2022-10-04 |
| 11460499 | Dual sided thermal management solutions for integrated circuit packages | Henning Braunisch, Veronica Strong, Brandon M. Rawlings, Johanna M. Swan, Shawna M. Liff | 2022-10-04 |
| 11437706 | Package with side-radiating wave launcher and waveguide | Georgios Dogiamis, Telesphor Kamgaing, Gilbert Dewey, Hyung-Jin Lee | 2022-09-06 |
| 11430751 | Microelectronic devices designed with 3D stacked ultra thin package modules for high frequency communications | Georgios Dogiamis, Telesphor Kamgaing, Sasha N. Oster | 2022-08-30 |
| 11424239 | Diodes for package substrate electrostatic discharge (ESD) protection | Adel A. Elsherbini, Feras Eid, Veronica Strong, Johanna M. Swan | 2022-08-23 |
| 11421376 | Inorganic piezoelectric materials formed on fibers and applications thereof | Shawna M. Liff, Feras Eid, Sasha N. Oster, Baris Bicen, Thomas L. Sounart +2 more | 2022-08-23 |
| 11394094 | Waveguide connector having a curved array of waveguides configured to connect a package to excitation elements | Telesphor Kamgaing, Sasha N. Oster, Georgios Dogiamis, Adel A. Elsherbini, Shawna M. Liff +2 more | 2022-07-19 |
| 11393766 | Multi-chip package with high density interconnects | Adel A. Elsherbini, Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati | 2022-07-19 |
| 11387187 | Embedded very high density (VHD) layer | Andrew Collins, Jianyong Xie, Sujit Sharan, Henning Braunisch | 2022-07-12 |
| 11360512 | Electronic device fabric integration | Nadine L. Dabby, Sasha N. Oster, Braxton Lathrop, Racquel L. Fygenson | 2022-06-14 |
| 11348897 | Microelectronic assemblies | Adel A. Elsherbini, Henning Braunisch, Shawna M. Liff, Johanna M. Swan, Patrick Morrow +3 more | 2022-05-31 |
| 11348882 | Package spark gap structure | Feras Eid, Johanna M. Swan, Adel A. Elsherbini, Veronica Strong | 2022-05-31 |
| 11335641 | Microelectronic assemblies | Johanna M. Swan | 2022-05-17 |
| 11329358 | Low loss and low cross talk transmission lines having l-shaped cross sections | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more | 2022-05-10 |
| 11328996 | Zero-misalignment two-via structures using photoimageable dielectric film buildup film, and transparent substrate with electroless plating | Veronica Strong, Brandon M. Rawlings | 2022-05-10 |
| 11328986 | Capacitor-wirebond pad structures for integrated circuit packages | Feras Eid, Georgios Dogiamis, Telesphor Kamgaing, Johanna M. Swan | 2022-05-10 |
| 11316497 | Multi-filter die | Georgios Dogiamis, Feras Eid, Telesphor Kamgaing, Johanna M. Swan | 2022-04-26 |
| 11310907 | Microelectronic package with substrate-integrated components | Georgios Dogiamis, Feras Eid, Telesphor Kamgaing, Johanna M. Swan | 2022-04-19 |
| 11309619 | Waveguide coupling systems and methods | Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing, Adel A. Elsherbini, Shawna M. Liff +1 more | 2022-04-19 |
| 11309192 | Integrated circuit package supports | Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram, Chung Kwang Christopher Tan | 2022-04-19 |
| 11296040 | Electrostatic discharge protection in integrated circuits | Adel A. Elsherbini, Feras Eid, Johanna M. Swan, Veronica Strong | 2022-04-05 |
| 11289431 | Electrostatic discharge protection in integrated circuits using materials with optically controlled electrical conductivity | Feras Eid, Veronica Strong, Adel A. Elsherbini, Johanna M. Swan | 2022-03-29 |
| 11264373 | Die backend diodes for electrostatic discharge (ESD) protection | Adel A. Elsherbini, Feras Eid, Veronica Strong, Johanna M. Swan | 2022-03-01 |
| 11264307 | Dual-damascene zero-misalignment-via process for semiconductor packaging | Hiroki Tanaka, Robert Alan May, Kristof Darmawikarta, Changhua Liu, Chung Kwang Christopher Tan +2 more | 2022-03-01 |