Issued Patents All Time
Showing 126–150 of 215 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10992017 | Semiconductor package comprising chiplets disposed on a substrate which are electromagnetically coupled by dielectric waveguides and a computing networks formed therefrom | Telesphor Kamgaing, Georgios Dogiamis, Gilbert Dewey, Hyung-Jin Lee | 2021-04-27 |
| 10976822 | Systems, methods, and apparatuses for implementing increased human perception of haptic feedback systems | Georgios Dogiamis, Johanna M. Swan | 2021-04-13 |
| 10971416 | Package power delivery using plane and shaped vias | Krishna Bharath, Mathew J. Manusharow, Adel A. Elsherbini, Mihir K. Roy, Yidnekachew S. Mekonnen +4 more | 2021-04-06 |
| 10969574 | Process for creating piezo-electric mirrors in package | Sasha N. Oster, Feras Eid, Johanna M. Swan, Shawna M. Liff, Thomas L. Sounart +2 more | 2021-04-06 |
| 10969576 | Piezo actuators for optical beam steering applications | Feras Eid, Sasha N. Oster, Shawna M. Liff, Johanna M. Swan, Thomas L. Sounart +2 more | 2021-04-06 |
| 10964178 | Systems, methods and apparatuses for implementing increased human perception of haptic feedback systems | Georgios Dogiamis, Johanna M. Swan | 2021-03-30 |
| 10959633 | Wearable sensing patch technologies | Amit S. Baxi, Adel A. Elsherbini, Vincent S. Mageshkumar, Sasha N. Oster, Feras Eid | 2021-03-30 |
| 10951248 | Radio frequency (RF) module with shared inductor | Telesphor Kamgaing, Feras Eid, Georgios Dogiamis, Johanna M. Swan | 2021-03-16 |
| 10950919 | System comprising first and second servers interconnected by a plurality of joined waveguide sections | Telesphor Kamgaing, Georgios Dogiamis, Sasha N. Oster, Adel A. Elsherbini, Brandon M. Rawlings +3 more | 2021-03-16 |
| 10937594 | Microelectronic devices designed with ultra-high-k dielectric capacitors integrated with package substrates | Thomas L. Sounart, Feras Eid, Georgios Dogiamis, Johanna M. Swan, Kristof Darmawikarta | 2021-03-02 |
| 10923429 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more | 2021-02-16 |
| 10872872 | Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling | Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Srinivas V. Pietambaram, Javier Soto Gonzalez +1 more | 2020-12-22 |
| 10816733 | Piezoelectrically actuated mirrors for optical communications | Sasha N. Oster, Johanna M. Swan, Feras Eid, Thomas L. Sounart, Shawna M. Liff +2 more | 2020-10-27 |
| 10820437 | Flexible packaging for a wearable electronic device | Son V. Nguyen, Rajat Goyal, David B. Lampner, Dilan Seneviratne, Albert S. Lopez +4 more | 2020-10-27 |
| 10798817 | Method for making a flexible wearable circuit | Javier Soto Gonzalez, Meizi Jiao, Shruti R. Jaywant, Oscar Ojeda, Sashi S. Kandanur +4 more | 2020-10-06 |
| 10763216 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more | 2020-09-01 |
| 10741534 | Multi-die microelectronic device with integral heat spreader | Sri Ranga Sai Boyapati, Kristof Darmawikarta, Rahul N. Manepalli, Robert Alan May, Srinivas V. Pietambaram | 2020-08-11 |
| 10727185 | Multi-chip package with high density interconnects | Adel A. Elsherbini, Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati | 2020-07-28 |
| 10714434 | Integrated magnetic inductors for embedded-multi-die interconnect bridge substrates | Srinivas V. Pietambaram, Kristof Darmawikarta | 2020-07-14 |
| 10685949 | Flexible electronic system with wire bonds | Mauro J. Kobrinsky, Johanna M. Swan, Rajendra C. Dias | 2020-06-16 |
| 10672701 | Thin electronic package elements using laser spallation | Vivek Raghunathan, Yonggang Li, Adel A. Elsherbini, Johanna M. Swan | 2020-06-02 |
| 10658566 | Piezoelectric driven switches integrated in organic, flexible displays | Shawna M. Liff, Feras Eid, Sasha N. Oster, Baris Bicen, Thomas L. Sounart +3 more | 2020-05-19 |
| 10649158 | Alignment of single and multi-mode optical fibers using piezoelectric actuators | Johanna M. Swan, Sasha N. Oster, Feras Eid, Baris Bicen, Thomas L. Sounart +2 more | 2020-05-12 |
| 10651525 | Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more | 2020-05-12 |
| 10634594 | Membrane test for mechanical testing of stretchable electronics | Ravindranth V. Mahajan, Rajendra C. Dias, Pramod Malatkar, Steven A. Klein, Vijay Subramania +1 more | 2020-04-28 |