Issued Patents All Time
Showing 151–175 of 215 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10566672 | Waveguide connector with tapered slot launcher | Adel A. Elsherbini, Sasha N. Oster, Johanna M. Swan, Georgios Dogiamis, Shawna M. Liff +1 more | 2020-02-18 |
| 10510669 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more | 2019-12-17 |
| 10492267 | Display for stretchable computing device | Adel A. Elsherbini, Sasha N. Oster, Nadine L. Dabby, Braxton Lathrop, Feras Eid | 2019-11-26 |
| 10477688 | Stretchable electronic assembly | Srinivas V. Pietambaram, Rahul N. Manepalli | 2019-11-12 |
| 10475736 | Via architecture for increased density interface | Arnab Sarkar, Arghya Sain, Kristof Darmawikarta, Henning Braunisch, Prashant Parmar +3 more | 2019-11-12 |
| 10468357 | Stretchable electronics fabrication method with strain redistribution layer | Rajendra C. Dias, Tatyana N. Andryushchenko, Mauro J. Kobrinsky, David Staines | 2019-11-05 |
| 10453812 | Polarization defined zero misalignment vias for semiconductor packaging | Hiroki Tanaka, Sri Ranga Sai Boyapati, Robert Alan May, Kristof Darmawikarta | 2019-10-22 |
| 10410939 | Package power delivery using plane and shaped vias | Krishna Bharath, Mathew J. Manusharow, Adel A. Elsherbini, Mihir K. Roy, Yidnekachew S. Mekonnen +4 more | 2019-09-10 |
| 10403564 | Dual-damascene zero-misalignment-via process for semiconductor packaging | Hiroki Tanaka, Robert Alan May, Kristof Darmawikarta, Changhua Liu, Chung Kwang Christopher Tan +2 more | 2019-09-03 |
| 10381291 | Lithographacally defined vias for organic package substrate scaling | Adel A. Elsherbini, Henning Braunisch, Brandon M. Rawlings, Feras Eid, Javier Soto | 2019-08-13 |
| 10368439 | Assembly architecture employing organic support for compact and improved assembly throughput | Adel A. Elsherbini, Sasha N. Oster, Shawna M. Liff | 2019-07-30 |
| 10353146 | Flexible and stretchable optical interconnect in wearable systems | Michael C. Rifani, Sasha N. Oster, Adel A. Elsherbini | 2019-07-16 |
| 10327331 | Stretchable computing device | Nadine L. Dabby, Adel A. Elsherbini, Braxton Lathrop, Sasha N. Oster | 2019-06-18 |
| 10327330 | Stretchable electronic assembly | Adel A. Elsherbini, Javier Soto Gonzalez, Dilan Seneviratne, Shruti R. Jaywant, Sashi S. Kandanur +5 more | 2019-06-18 |
| 10314171 | Package assembly with hermetic cavity | Feras Eid, Johanna M. Swan | 2019-06-04 |
| 10269942 | Complementary tunneling FET devices and method for forming the same | — | 2019-04-23 |
| 10263312 | Plurality of dielectric waveguides including dielectric waveguide cores for connecting first and second server boards | Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing, Adel A. Elsherbini, Shawna M. Liff +3 more | 2019-04-16 |
| 10256521 | Waveguide connector with slot launcher | Adel A. Elsherbini, Sasha N. Oster, Johanna M. Swan, Georgios Dogiamis, Shawna M. Liff +1 more | 2019-04-09 |
| 10251272 | Microelectronic devices designed with ultra-high-k dielectric capacitors integrated with package substrates | Feras Eid, Thomas L. Sounart, Georgios Dogiamis, Johanna M. Swan | 2019-04-02 |
| 10249925 | Dielectric waveguide bundle including a supporting feature for connecting first and second server boards | Georgios Dogiamis, Sasha N. Oster, Telesphor Kamgaing, Adel A. Elsherbini, Johanna M. Swan +3 more | 2019-04-02 |
| 10215164 | Fabric-based piezoelectric energy harvesting | Nadine L. Dabby, Feras Eid, Adel A. Elsherbini, Braxton Lathrop, Sasha N. Oster | 2019-02-26 |
| 10206277 | Gradient encapsulant protection of devices in stretchable electronics | Rajendra C. Dias, Manish Dubey, Tatyana N. Andryushchenko, David Staines | 2019-02-12 |
| 10204855 | Bendable and stretchable electronic devices and methods | Alejandro X. Levander, Tatyana N. Andryushchenko, David Staines, Mauro J. Kobrinsky, Dilan Seneviratne +3 more | 2019-02-12 |
| 10186465 | Package-integrated microchannels | Feras Eid, Adel A. Elsherbini, Henning Braunisch, Yidnekachew S. Mekonnen, Krishna Bharath +2 more | 2019-01-22 |
| 10121679 | Package substrate first-level-interconnect architecture | Kristof Darmawikarta, Arnab Sarkar, Hiroki Tanaka, Robert Alan May, Sri Ranga Sai Boyapati | 2018-11-06 |