AA

Aleksandar Aleksov

IN Intel: 215 patents #47 of 30,777Top 1%
📍 Chandler, AZ: #3 of 3,331 inventorsTop 1%
🗺 Arizona: #29 of 32,909 inventorsTop 1%
Overall (All Time): #2,835 of 4,157,543Top 1%
215
Patents All Time

Issued Patents All Time

Showing 201–215 of 215 patents

Patent #TitleCo-InventorsDate
9526285 Flexible computing fabric Ravindranath V. Mahajan, Sairam Agraharam, Ian A. Young, John C. Johnson, Debendra Mallik +1 more 2016-12-27
9520378 Thermal matched composite die Shawna M. Liff 2016-12-13
9323327 System and method for providing tactile feedback Ravindranath V. Mahajan, Brian S. Doyle 2016-04-26
9257276 Organic thin film passivation of metal interconnections Tony Dambrauskas, Danish Faruqui, Mark S. Hlad, Edward R. Prack 2016-02-09
9258880 Package substrate and die spacer layers having a ceramic backbone Vladimir Noveski, Sujit Sharan, Shankar Ganapathysubramanian 2016-02-09
9233835 Shaped and oriented solder joints Sanka Ganesan 2016-01-12
9118188 Wireless charging system Brian S. Doyle, Ravindranath V. Mahajan 2015-08-25
9076882 Methods for high precision microelectronic die integration Ravindranath V. Mahajan, Omkar G. Karhade, Nitin A. Deshpande 2015-07-07
9010618 Magnetic attachment structure Rajasekaran Swaminathan, Ting Zhong 2015-04-21
9001520 Microelectronic structures having laminated or embedded glass routing structures for high density packaging Qing Ma, Johanna M. Swan, Robert Starkston, John S. Guzek, Robert L. Sankman 2015-04-07
8621744 Method of manufacturing an inductor for a microelectronic device Gloria Alejandra Camacho-Bragado 2014-01-07
8604353 Package substrate and die spacer layers having a ceramic backbone Vladimir Noveski, Sujit Sharan, Shankar Ganapathysubramanian 2013-12-10
8434668 Magnetic attachment structure Rajasekaran Swaminathan, Ting Zhong 2013-05-07
8227904 Multi-chip package and method of providing die-to-die interconnects in same Henning Braunisch, Chia-Pin Chiu, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more 2012-07-24
8186051 Method for fabricating package substrate and die spacer layers having a ceramic backbone Vladimir Noveski, Sujit Sharan, Shankar Ganapathysubramanian 2012-05-29