Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113026 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Stefanie M. Lotz, Johanna M. Swan +1 more | 2024-10-08 |
| 11876053 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Stefanie M. Lotz, Johanna M. Swan +1 more | 2024-01-16 |
| 11824008 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Stefanie M. Lotz, Johanna M. Swan +1 more | 2023-11-21 |
| 10923429 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Stefanie M. Lotz, Johanna M. Swan +1 more | 2021-02-16 |
| 10763216 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Stefanie M. Lotz, Johanna M. Swan +1 more | 2020-09-01 |
| 10510669 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Stefanie M. Lotz, Johanna M. Swan +1 more | 2019-12-17 |
| 8532449 | Wafer integrated optical sub-modules | Edris M. Mohammed | 2013-09-10 |
| 8383949 | Method to form lateral pad on edge of wafer | Edris M. Mohammed | 2013-02-26 |
| 8227904 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Stefanie M. Lotz, Johanna M. Swan +1 more | 2012-07-24 |