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USPTO Patent Rankings Data through Dec 31, 2025
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Hinmeng Au — 9 Patents

Intel: 9 patents #4,462 of 30,777Top 15%
Phoenix, AZ: #718 of 6,660 inventorsTop 15%
Arizona: #4,088 of 32,909 inventorsTop 15%
Overall (All Time): #535,341 of 4,157,543Top 15%
9 Patents All Time
Hinmeng Au has been granted 9 US patents while listed as an inventor at Intel. The first was granted in 2012 and the most recent in October 2024. Hinmeng Au ranks #535,341 of 4,157,543 US inventors in our database (top 12.9%). Patent records list Hinmeng Au in Phoenix, AZ, US.

Issued Patents All Time

Showing 1–9 of 9 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12113026 Multi-chip package and method of providing die-to-die interconnects in same Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Stefanie M. Lotz, Johanna M. Swan +1 more 2024-10-08 $19,971,000
11876053 Multi-chip package and method of providing die-to-die interconnects in same Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Stefanie M. Lotz, Johanna M. Swan +1 more 2024-01-16 $42,805,000
11824008 Multi-chip package and method of providing die-to-die interconnects in same Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Stefanie M. Lotz, Johanna M. Swan +1 more 2023-11-21 $28,968,000
10923429 Multi-chip package and method of providing die-to-die interconnects in same Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Stefanie M. Lotz, Johanna M. Swan +1 more 2021-02-16 $35,223,000
10763216 Multi-chip package and method of providing die-to-die interconnects in same Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Stefanie M. Lotz, Johanna M. Swan +1 more 2020-09-01 $24,773,000
10510669 Multi-chip package and method of providing die-to-die interconnects in same Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Stefanie M. Lotz, Johanna M. Swan +1 more 2019-12-17 $31,829,000
8532449 Wafer integrated optical sub-modules Edris M. Mohammed 2013-09-10 $11,653,000
8383949 Method to form lateral pad on edge of wafer Edris M. Mohammed 2013-02-26 $10,377,000
8227904 Multi-chip package and method of providing die-to-die interconnects in same Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Stefanie M. Lotz, Johanna M. Swan +1 more 2012-07-24 $18,521,000