Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468357 | Stretchable electronics fabrication method with strain redistribution layer | Rajendra C. Dias, Mauro J. Kobrinsky, Aleksandar Aleksov, David Staines | 2019-11-05 |
| 10206277 | Gradient encapsulant protection of devices in stretchable electronics | Rajendra C. Dias, Manish Dubey, Aleksandar Aleksov, David Staines | 2019-02-12 |
| 10204855 | Bendable and stretchable electronic devices and methods | Alejandro X. Levander, David Staines, Mauro J. Kobrinsky, Aleksandar Aleksov, Dilan Seneviratne +3 more | 2019-02-12 |
| 9391019 | Scalable interconnect structures with selective via posts | Mauro J. Kobrinsky, Ramanan V. Chebiam, Hui Jae Yoo | 2016-07-12 |
| 7585760 | Method for forming planarizing copper in a low-k dielectric | Anne Miller | 2009-09-08 |
| 7560380 | Chemical dissolution of barrier and adhesion layers | Anne Miller | 2009-07-14 |
| 7223685 | Damascene fabrication with electrochemical layer removal | Anne Miller | 2007-05-29 |
| 6790336 | Method of fabricating damascene structures in mechanically weak interlayer dielectrics | — | 2004-09-14 |