| 10858543 |
Anti-corrosion polishing composition |
Hooi-Sung Kim |
2020-12-08 |
|
| 10570315 |
Buffered slurry formulation for cobalt CMP |
Hooi-Sung Kim |
2020-02-25 |
|
| 9576818 |
Polishing slurry for cobalt removal |
Jimmy Granstrom |
2017-02-21 |
|
| 9150758 |
Polishing composition, polishing method using same, and method for producing semiconductor device |
Chiaki Saito, Kanako Fukuda |
2015-10-06 |
|
| 7731864 |
Slurry for chemical mechanical polishing of aluminum |
Allen D. Feller |
2010-06-08 |
$11,764,000 |
| 7666465 |
Introducing nanotubes in trenches and structures formed thereby |
Paul B. Fischer, Kenneth Cadien, Chris Barns |
2010-02-23 |
$16,403,000 |
| 7585760 |
Method for forming planarizing copper in a low-k dielectric |
Tatyana N. Andryushchenko |
2009-09-08 |
$22,439,000 |
| 7560380 |
Chemical dissolution of barrier and adhesion layers |
Tatyana N. Andryushchenko |
2009-07-14 |
$21,399,000 |
| 7223685 |
Damascene fabrication with electrochemical layer removal |
Tatyana N. Andryushchenko |
2007-05-29 |
$13,871,000 |
| 7201784 |
Surfactant slurry additives to improve erosion, dishing, and defects during chemical mechanical polishing of copper damascene with low k dielectrics |
Charles A. Poutasse |
2007-04-10 |
$13,767,000 |
| 7157378 |
Method for making a semiconductor device having a high-k gate dielectric layer and a metal gate electrode |
Justin K. Brask, Chris Barns, Mark L. Doczy, Uday Shah, Jack T. Kavalieros +3 more |
2007-01-02 |
|
| 7109557 |
Sacrificial dielectric planarization layer |
Chris Barns, Kevin P. O'Brien |
2006-09-19 |
$12,802,000 |
| 6908863 |
Sacrificial dielectric planarization layer |
Chris Barns, Kevin P. O'Brien |
2005-06-21 |
$21,477,000 |
| 6909193 |
High pH slurry for chemical mechanical polishing of copper |
A. Feller, Kenneth Cadien |
2005-06-21 |
$21,477,000 |
| 6852631 |
Copper polish slurry for reduced interlayer dielectric erosion and method of using same |
— |
2005-02-08 |
$36,565,000 |
| 6838383 |
Copper polish slurry for reduced interlayer dielectric erosion and method of using same |
— |
2005-01-04 |
$23,080,000 |
| 6825117 |
High PH slurry for chemical mechanical polishing of copper |
A. Feller, Kenneth Cadien |
2004-11-30 |
$36,984,000 |
| 6787061 |
Copper polish slurry for reduced interlayer dielectric erosion and method of using same |
— |
2004-09-07 |
$21,424,000 |
| 6752844 |
Ceric-ion slurry for use in chemical-mechanical polishing |
A. Feller, Kenneth Cadien |
2004-06-22 |
$27,859,000 |
| 6740591 |
Slurry and method for chemical mechanical polishing of copper |
A. Feller, Kenneth Cadien |
2004-05-25 |
$32,256,000 |
| 6719920 |
Slurry for polishing a barrier layer |
— |
2004-04-13 |
$35,249,000 |
| 6719614 |
Method and chemistry for cleaning of oxidized copper during chemical mechanical polishing |
A. Feller, Kenneth Cadien |
2004-04-13 |
$35,249,000 |
| 6596640 |
Method of forming a raised contact for a substrate |
Paul B. Fishcer, James A. Boardman |
2003-07-22 |
$27,595,000 |
| 6464568 |
Method and chemistry for cleaning of oxidized copper during chemical mechanical polishing |
A. Feller, Kenneth Cadien |
2002-10-15 |
$56,657,000 |
| 6443814 |
Method and chemistry for cleaning of oxidized copper during chemical mechanical polishing |
A. Feller, Kenneth Cadien |
2002-09-03 |
$41,426,000 |
