Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10858543 | Anti-corrosion polishing composition | Hooi-Sung Kim | 2020-12-08 |
| 10570315 | Buffered slurry formulation for cobalt CMP | Hooi-Sung Kim | 2020-02-25 |
| 9576818 | Polishing slurry for cobalt removal | Jimmy Granstrom | 2017-02-21 |
| 9150758 | Polishing composition, polishing method using same, and method for producing semiconductor device | Chiaki Saito, Kanako Fukuda | 2015-10-06 |
| 7731864 | Slurry for chemical mechanical polishing of aluminum | Allen D. Feller | 2010-06-08 |
| 7666465 | Introducing nanotubes in trenches and structures formed thereby | Paul B. Fischer, Kenneth Cadien, Chris Barns | 2010-02-23 |
| 7585760 | Method for forming planarizing copper in a low-k dielectric | Tatyana N. Andryushchenko | 2009-09-08 |
| 7560380 | Chemical dissolution of barrier and adhesion layers | Tatyana N. Andryushchenko | 2009-07-14 |
| 7223685 | Damascene fabrication with electrochemical layer removal | Tatyana N. Andryushchenko | 2007-05-29 |
| 7201784 | Surfactant slurry additives to improve erosion, dishing, and defects during chemical mechanical polishing of copper damascene with low k dielectrics | Charles A. Poutasse | 2007-04-10 |
| 7157378 | Method for making a semiconductor device having a high-k gate dielectric layer and a metal gate electrode | Justin K. Brask, Chris Barns, Mark L. Doczy, Uday Shah, Jack T. Kavalieros +3 more | 2007-01-02 |
| 7109557 | Sacrificial dielectric planarization layer | Chris Barns, Kevin P. O'Brien | 2006-09-19 |
| 6908863 | Sacrificial dielectric planarization layer | Chris Barns, Kevin P. O'Brien | 2005-06-21 |
| 6909193 | High pH slurry for chemical mechanical polishing of copper | A. Feller, Kenneth Cadien | 2005-06-21 |
| 6852631 | Copper polish slurry for reduced interlayer dielectric erosion and method of using same | — | 2005-02-08 |
| 6838383 | Copper polish slurry for reduced interlayer dielectric erosion and method of using same | — | 2005-01-04 |
| 6825117 | High PH slurry for chemical mechanical polishing of copper | A. Feller, Kenneth Cadien | 2004-11-30 |
| 6787061 | Copper polish slurry for reduced interlayer dielectric erosion and method of using same | — | 2004-09-07 |
| 6752844 | Ceric-ion slurry for use in chemical-mechanical polishing | A. Feller, Kenneth Cadien | 2004-06-22 |
| 6740591 | Slurry and method for chemical mechanical polishing of copper | A. Feller, Kenneth Cadien | 2004-05-25 |
| 6719920 | Slurry for polishing a barrier layer | — | 2004-04-13 |
| 6719614 | Method and chemistry for cleaning of oxidized copper during chemical mechanical polishing | A. Feller, Kenneth Cadien | 2004-04-13 |
| 6596640 | Method of forming a raised contact for a substrate | Paul B. Fishcer, James A. Boardman | 2003-07-22 |
| 6464568 | Method and chemistry for cleaning of oxidized copper during chemical mechanical polishing | A. Feller, Kenneth Cadien | 2002-10-15 |
| 6443814 | Method and chemistry for cleaning of oxidized copper during chemical mechanical polishing | A. Feller, Kenneth Cadien | 2002-09-03 |