Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chemical dissolution of barrier and adhesion layers

Chemical dissolution of barrier and adhesion layers

US Patent 7560380 · Granted Jul 14, 2009

Estimated economic value: $21,399,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Anti-corrosion polishing composition2020
Buffered slurry formulation for cobalt CMP2020
Stretchable electronics fabrication method with strain redistribution layer2019
Bendable and stretchable electronic devices and methods2019
Gradient encapsulant protection of devices in stretchable electronics2019
Polishing slurry for cobalt removal2017
Scalable interconnect structures with selective via posts2016
Polishing composition, polishing method using same, and method for producing sem2015
Slurry for chemical mechanical polishing of aluminum2010
Introducing nanotubes in trenches and structures formed thereby2010
Method for forming planarizing copper in a low-k dielectric2009
Method for forming planarizing copper in a low-k dielectric2009