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Home › Surfactant slurry additives to improve erosion, dishing, and defects during chemical mechanical polishing of copper damascene with low k dielectrics

Surfactant slurry additives to improve erosion, dishing, and defects during chemical mechanical polishing of copper damascene with low k dielectrics

US Patent 7201784 · Granted Apr 10, 2007

Estimated economic value: $13,767,000 ⓘ

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