Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11001733 | Compositions for polishing cobalt and low-K material surfaces | Hooi-Sung Kim | 2021-05-11 |
| RE39615 | Adhesive compositions and copper foils and copper clad laminates using same | — | 2007-05-08 |
| 7201784 | Surfactant slurry additives to improve erosion, dishing, and defects during chemical mechanical polishing of copper damascene with low k dielectrics | Anne Miller | 2007-04-10 |
| 6589381 | Coatings for improved resin dust resistance | Michael A. Centanni | 2003-07-08 |
| 6299721 | Coatings for improved resin dust resistance | Michael A. Centanni | 2001-10-09 |
| 6296949 | Copper coated polyimide with metallic protective layer | Tad Bergstresser | 2001-10-02 |
| 6268070 | Laminate for multi-layer printed circuit | Tad Bergstresser | 2001-07-31 |
| 6221176 | Surface treatment of copper to prevent microcracking in flexible circuits | Harish D. Merchant, Chin-Ho Lee | 2001-04-24 |
| 6132851 | Adhesive compositions and copper foils and copper clad laminates using same | — | 2000-10-17 |
| 6117536 | Adhesion promoting layer for use with epoxy prepregs | — | 2000-09-12 |
| 5629098 | Epoxy adhesives and copper foils and copper clad laminates using same | Katherine V. Sack, Andrea M. Kovacs, James R. Winchester | 1997-05-13 |
| 5622782 | Foil with adhesion promoting layer derived from silane mixture | Andrea M. Kovacs | 1997-04-22 |
| 5614324 | Multi-layer structures containing a silane adhesion promoting layer | Richard L. Luthy | 1997-03-25 |
| 5525433 | Epoxy adhesives and copper foils and copper clad laminates using same | Katherine V. Sack, Andrea M. Kovacs, James R. Winchester | 1996-06-11 |