Issued Patents All Time
Showing 101–125 of 215 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11264239 | Polarization defined zero misalignment vias for semiconductor packaging | Hiroki Tanaka, Sri Ranga Sai Boyapati, Robert Alan May, Kristof Darmawikarta | 2022-03-01 |
| 11257745 | Electroless metal-defined thin pad first level interconnects for lithographically defined vias | Veronica Strong, Kristof Darmawikarta, Arnab Sarkar | 2022-02-22 |
| 11244912 | Semiconductor package having a coaxial first layer interconnect | Sai Vadlamani, Rahul Jain, Kyu Oh Lee, Kristof Darmawikarta, Robert Alan May +2 more | 2022-02-08 |
| 11239155 | Conductive contact structures for electrostatic discharge protection in integrated circuits | Adel A. Elsherbini, Feras Eid, Johanna M. Swan, Veronica Strong | 2022-02-01 |
| 11227825 | High performance integrated RF passives using dual lithography process | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, William J. Lambert, Robert L. Sankman +6 more | 2022-01-18 |
| 11222836 | Zero-misalignment two-via structures | Veronica Strong, Brandon M. Rawlings, Johanna M. Swan | 2022-01-11 |
| 11222856 | Package-integrated bistable switch for electrostatic discharge (ESD) protection | Feras Eid, Veronica Strong, Adel A. Elsherbini, Johanna M. Swan | 2022-01-11 |
| 11211345 | In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same | Telesphor Kamgaing, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Eyal Fayneh, Ofir Degani +2 more | 2021-12-28 |
| 11189580 | Electrostatic discharge protection in integrated circuits | Adel A. Elsherbini, Krishna Bharath, Feras Eid, Johanna M. Swan, Veronica Strong | 2021-11-30 |
| 11158917 | Dual-substrate waveguide filter | Telesphor Kamgaing, Georgios Dogiamis, Feras Eid, Johanna M. Swan | 2021-10-26 |
| 11147197 | Microelectronic package electrostatic discharge (ESD) protection | Veronica Strong, Johanna M. Swan, Adel A. Elsherbini, Feras Eid | 2021-10-12 |
| 11133263 | High-density interconnects for integrated circuit packages | Veronica Strong, Henning Braunisch, Brandon M. Rawlings, Johanna M. Swan, Shawna M. Liff | 2021-09-28 |
| 11107781 | RFIC having coaxial interconnect and molded layer | Srinivas V. Pietambaram, Rahul N. Manepalli, Kristof Darmawikarta, Robert Alan May, Telesphor Kamgaing | 2021-08-31 |
| 11101205 | Interconnection structure fabrication using grayscale lithography | Johanna M. Swan, Henning Braunisch, Shawna M. Liff, Brandon M. Rawlings, Veronica Strong | 2021-08-24 |
| 11095012 | Methods for conductively coating millimeter waveguides | Georgios Dogiamis, Telesphor Kamgaing, Sasha N. Oster, Adel A. Elsherbini, Shawna M. Liff +3 more | 2021-08-17 |
| 11088103 | First layer interconnect first on carrier approach for EMIB patch | Changhua Liu, Xiaoying Guo, Steve Cho, Leonel Arana, Robert Alan May +1 more | 2021-08-10 |
| 11081768 | Fabricating an RF filter on a semiconductor package using selective seeding | Brandon C. Marin, Jeremy Ecton, Kristof Darmawikarta, Yonggang Li, Dilan Seneviratne | 2021-08-03 |
| 11062947 | Inorganic dies with organic interconnect layers and related structures | Feras Eid, Telesphor Kamgaing, Georgios Dogiamis, Johanna M. Swan | 2021-07-13 |
| 11050155 | Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems | Feras Eid, Sasha N. Oster, Telesphor Kamgaing, Georgios Dogiamis | 2021-06-29 |
| 11031666 | Waveguide comprising a dielectric waveguide core surrounded by a conductive layer, where the core includes multiple spaces void of dielectric | Adel A. Elsherbini, Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing, Shawna M. Liff +3 more | 2021-06-08 |
| 11024933 | Waveguide comprising an extruded dielectric waveguide core that is coextruded with an outer conductive layer | Brandon M. Rawlings, Shawna M. Liff, Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing +3 more | 2021-06-01 |
| 11016288 | Adaptable displays using piezoelectric actuators | Sasha N. Oster, Feras Eid, Johanna M. Swan, Thomas L. Sounart, Shawna M. Liff +2 more | 2021-05-25 |
| 11011470 | Microelectronic package with mold-integrated components | Georgios Dogiamis, Feras Eid, Telesphor Kamgaing, Johanna M. Swan | 2021-05-18 |
| 10998272 | Organic interposers for integrated circuit packages | Henning Braunisch, Shawna M. Liff, Brandon M. Rawlings, Veronica Strong, Johanna M. Swan | 2021-05-04 |
| 10998879 | Monolithic die with acoustic wave resonators and active circuitry | Telesphor Kamgaing, Georgios Dogiamis, Feras Eid, Johanna M. Swan | 2021-05-04 |