Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11296052 | TSV-less die stacking using plated pillars/through mold interconnect | Preston T. Meyers, Javier A. Falcon, Shawna M. Liff, Joe Saucedo, Adel A. Elsherbini +1 more | 2022-04-05 | $18,322,000 |
| 10820437 | Flexible packaging for a wearable electronic device | Aleksandar Aleksov, Son V. Nguyen, Rajat Goyal, David B. Lampner, Dilan Seneviratne +4 more | 2020-10-27 | $34,955,000 |