Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Hybrid bonding technologies with thermal expansion compensation structures

Hybrid bonding technologies with thermal expansion compensation structures

US Patent 12444672 · Granted Oct 14, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Flexible die to floor planning with bump pitch scale through glass core via pitc2025
Flexible die to floor planning with bump pitch scale through glass core via pitc2025
Measuring device, measuring method, measuring system, and radiation therapy syst2025
Photonic interconnect and components in glass2025
Integrated optical coupler2025
Integrated optical coupler2025
Integrated optical coupler2025
Substrate integrated thin film capacitors using amorphous high-k dielectrics2025
Microchannel device2025
Driver assistance system2025
Cooling of conformal power delivery structures2025
Faraday rotator interconnect as a through-via configuration in a patch architect2025