HL

Harry Liang

IN Intel: 1 patents #18,218 of 30,777Top 60%
Overall (All Time): #3,420,510 of 4,157,543Top 85%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7064446 Under bump metallization layer to enable use of high tin content solder bumps John Barnak, Gerald Feldewerth, Ming Fang, Kevin J. Lee, Tzuen-Luh Huang +3 more 2006-06-20