Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7001782 | Method and apparatus for filling interlayer vias on ferroelectric polymer substrates | Daniel Diana, Ebrahim Andideh, Valery M. Dubin, Ming Fang | 2006-02-21 | $16,743,000 |