Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388407 | Method for manufacturing acoustic devices with improved performance | Derya Deniz, Matthew Wasilik, John Belsick | 2025-08-12 |
| 12031949 | Preventing epoxy bleed-out for biosensor devices | John Belsick, Matthew Wasilik, Rio Rivas, Bang Nguyen, Derya Deniz | 2024-07-09 |
| 11990885 | Method for manufacturing acoustic devices with improved performance | Derya Deniz, Matthew Wasilik, John Belsick | 2024-05-21 |
| 10931257 | WLP BAW device with through-WLP vias | Paul Stokes, Fabien Dumont | 2021-02-23 |
| 10659000 | Fluidic sensor device having UV-blocking cover | — | 2020-05-19 |
| 10574210 | BAW devices having top electrode leads with reduced reflectance | Matthew Wasilik | 2020-02-25 |
| 10367470 | Wafer-level-packaged BAW devices with surface mount connection structures | Matthew Wasilik, Ian Y. K. Yee, Bang Nguyen, Ebrahim Andideh, Robert Kraft | 2019-07-30 |
| 10315918 | Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays | Roland W. Gooch, Stephen H. Black, Thomas A. Kocian, Adam M. Kennedy | 2019-06-11 |
| 10262913 | Wafer level package solder barrier used as vacuum getter | Roland W. Gooch, Adam M. Kennedy, Stephen H. Black, Thomas A. Kocian | 2019-04-16 |
| 9969610 | Wafer level MEMS package including dual seal ring | Adam M. Kennedy, Thomas A. Kocian, Mark A. Lamb | 2018-05-15 |
| 9966320 | Wafer level package solder barrier used as vacuum getter | Roland W. Gooch, Adam M. Kennedy, Stephen H. Black, Thomas A. Kocian | 2018-05-08 |
| 9771258 | Wafer level MEMS package including dual seal ring | Adam M. Kennedy, Thomas A. Kocian, Mark A. Lamb | 2017-09-26 |
| 9708181 | Hermetically sealed package having stress reducing layer | Adam M. Kennedy, Stephen H. Black, Tse E. Wong, Thomas A. Kocian, Gregory D. Tracy | 2017-07-18 |
| 9520332 | Wafer level package solder barrier used as vacuum getter | Roland W. Gooch, Adam M. Kennedy, Stephen H. Black, Thomas A. Kocian | 2016-12-13 |
| 9427776 | Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays | Roland W. Gooch, Stephen H. Black, Thomas A. Kocian, Adam M. Kennedy | 2016-08-30 |
| 9334154 | Hermetically sealed package having stress reducing layer | Adam M. Kennedy, Stephen H. Black, Tse E. Wong, Thomas A. Kocian, Gregory D. Tracy | 2016-05-10 |
| 9227839 | Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling | Roland W. Gooch, Stephen H. Black, Thomas A. Kocian, Adam M. Kennedy | 2016-01-05 |
| 9196556 | Getter structure and method for forming such structure | Roland W. Gooch, Adam M. Kennedy, Stephen H. Black, Thomas A. Kocian | 2015-11-24 |
| 9187312 | Integrated bondline spacers for wafer level packaged circuit devices | Roland W. Gooch, Thomas A. Kocian, Stephen H. Black, Adam M. Kennedy | 2015-11-17 |
| 9174836 | Integrated bondline spacers for wafer level packaged circuit devices | Roland W. Gooch, Thomas A. Kocian, Stephen H. Black, Adam M. Kennedy | 2015-11-03 |
| 9132496 | Reducing formation of oxide on solder | Thomas A. Kocian, Roland W. Gooch | 2015-09-15 |
| 9105800 | Method of forming deposited patterns on a surface | Roland W. Gooch, Thomas A. Kocian, Adam M. Kennedy, Stephen H. Black | 2015-08-11 |
| 9093444 | Wafer level package solder barrier used as vacuum getter | Roland W. Gooch, Adam M. Kennedy, Stephen H. Black, Thomas A. Kocian | 2015-07-28 |
| 9073298 | Disposable bond gap control structures | Roland W. Gooch | 2015-07-07 |
| 9022584 | Protecting an optical surface | Stephen H. Black, Thomas A. Kocian | 2015-05-05 |