Issued Patents All Time
Showing 25 most recent of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12192658 | Interface circuit for photodetectors providing full-frame integration and pixel-level digitization | Paul Richard Behmen, Francisco Tejada | 2025-01-07 |
| 12155951 | Interface circuit for photodetectors providing full-frame integration and pixel-level digitization | Paul Richard Behmen, Francisco Tejada | 2024-11-26 |
| 11985442 | Bias circuit with improved noise performance | Paul Richard Behmen, Francisco Tejada | 2024-05-14 |
| 10315918 | Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays | Roland W. Gooch, Buu Q. Diep, Thomas A. Kocian, Adam M. Kennedy | 2019-06-11 |
| 10262913 | Wafer level package solder barrier used as vacuum getter | Roland W. Gooch, Buu Q. Diep, Adam M. Kennedy, Thomas A. Kocian | 2019-04-16 |
| 9966320 | Wafer level package solder barrier used as vacuum getter | Roland W. Gooch, Buu Q. Diep, Adam M. Kennedy, Thomas A. Kocian | 2018-05-08 |
| 9865519 | Use of an external getter to reduce package pressure | Adam M. Kennedy | 2018-01-09 |
| 9708181 | Hermetically sealed package having stress reducing layer | Adam M. Kennedy, Buu Q. Diep, Tse E. Wong, Thomas A. Kocian, Gregory D. Tracy | 2017-07-18 |
| 9570321 | Use of an external getter to reduce package pressure | Adam M. Kennedy | 2017-02-14 |
| 9520332 | Wafer level package solder barrier used as vacuum getter | Roland W. Gooch, Buu Q. Diep, Adam M. Kennedy, Thomas A. Kocian | 2016-12-13 |
| 9427776 | Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays | Roland W. Gooch, Buu Q. Diep, Thomas A. Kocian, Adam M. Kennedy | 2016-08-30 |
| 9407820 | Method and apparatus for inhibiting diversion of devices using an embedded accelerometer | Paolo Masini | 2016-08-02 |
| 9334154 | Hermetically sealed package having stress reducing layer | Adam M. Kennedy, Buu Q. Diep, Tse E. Wong, Thomas A. Kocian, Gregory D. Tracy | 2016-05-10 |
| 9277142 | Infrared thermal imaging system and method | Matthew Kuiken | 2016-03-01 |
| 9227839 | Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling | Roland W. Gooch, Thomas A. Kocian, Adam M. Kennedy, Buu Q. Diep | 2016-01-05 |
| 9196556 | Getter structure and method for forming such structure | Roland W. Gooch, Adam M. Kennedy, Thomas A. Kocian, Buu Q. Diep | 2015-11-24 |
| 9187312 | Integrated bondline spacers for wafer level packaged circuit devices | Roland W. Gooch, Buu Q. Diep, Thomas A. Kocian, Adam M. Kennedy | 2015-11-17 |
| 9174836 | Integrated bondline spacers for wafer level packaged circuit devices | Roland W. Gooch, Buu Q. Diep, Thomas A. Kocian, Adam M. Kennedy | 2015-11-03 |
| 9105800 | Method of forming deposited patterns on a surface | Roland W. Gooch, Thomas A. Kocian, Buu Q. Diep, Adam M. Kennedy | 2015-08-11 |
| 9093444 | Wafer level package solder barrier used as vacuum getter | Roland W. Gooch, Buu Q. Diep, Adam M. Kennedy, Thomas A. Kocian | 2015-07-28 |
| 9022584 | Protecting an optical surface | Thomas A. Kocian, Buu Q. Diep | 2015-05-05 |
| 8980676 | Fabrication of window cavity cap structures in wafer level packaging | Buu Q. Diep | 2015-03-17 |
| 8884815 | Antenna-coupled imager having pixels with integrated lenslets | Michael A. Gritz, Robert F. Burkholder, Borys P. Kolasa | 2014-11-11 |
| 8809784 | Incident radiation detector packaging | Roland W. Gooch, Thomas A. Kocian, Buu Q. Diep | 2014-08-19 |
| 8736045 | Integrated bondline spacers for wafer level packaged circuit devices | Roland W. Gooch, Buu Q. Diep, Thomas A. Kocian, Allan M. Kennedy | 2014-05-27 |