Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446466 | Mechanically improved microelectronic thermal interface structure for low die stress | Jason G. Milne, Yung-Cheng Lee | 2019-10-15 |
| 9708181 | Hermetically sealed package having stress reducing layer | Adam M. Kennedy, Buu Q. Diep, Stephen H. Black, Thomas A. Kocian, Gregory D. Tracy | 2017-07-18 |
| 9706662 | Adaptive interposer and electronic apparatus | Kenneth T. Teshiba, Shea Chen | 2017-07-11 |
| 9648729 | Stress reduction interposer for ceramic no-lead surface mount electronic device | Shea Chen, Hoyoung C. Choe | 2017-05-09 |
| 9334154 | Hermetically sealed package having stress reducing layer | Adam M. Kennedy, Buu Q. Diep, Stephen H. Black, Thomas A. Kocian, Gregory D. Tracy | 2016-05-10 |
| 8921992 | Stacked wafer with coolant channels | Christopher R. Koontz, Jason G. Milne | 2014-12-30 |
| 7888176 | Stacked integrated circuit assembly | Samuel D. Tonomura, Stephen E. Sox, Timothy E. Dearden, Clifton Quan, Polwin C. Chan +1 more | 2011-02-15 |
| 7605477 | Stacked integrated circuit assembly | Samuel D. Tonomura, Stephen E. Sox, Timothy E. Dearden, Clifton Quan, Polwin C. Chan +1 more | 2009-10-20 |
| 7298235 | Circuit board assembly and method of attaching a chip to a circuit board with a fillet bond not covering RF traces | Mark S. Hauhe, Kevin C. Rolston, Clifton Quan, Harold S. Fenger | 2007-11-20 |
| 5899753 | Spring-loaded ball contact connector | Harold M. Cohen, Mohi Sobhani | 1999-05-04 |