Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688700 | Die package having security features | Jason M. Kehl, Steve F. Mayrose, Aaron George | 2023-06-27 |
| 10784234 | Die encapsulation in oxide bonded wafer stack | John J. Drab | 2020-09-22 |
| 10581177 | High frequency polymer on metal radiator | Robert S. Isom, Andrew J. Marquette | 2020-03-03 |
| 10541461 | Tile for an active electronically scanned array (AESA) | Mary A. Teshiba, Kevin C. Rolston, John J. Drab | 2020-01-21 |
| 10446466 | Mechanically improved microelectronic thermal interface structure for low die stress | Tse E. Wong, Yung-Cheng Lee | 2019-10-15 |
| 10242967 | Die encapsulation in oxide bonded wafer stack | John J. Drab | 2019-03-26 |
| 9960101 | Micro-hoses for integrated circuit and device level cooling | — | 2018-05-01 |
| 9893430 | Short coincident phased slot-fed dual polarized aperture | Allen Wang, Fangchou Yang, Jar Jueh Lee | 2018-02-13 |
| 9502330 | Coolant distribution structure for monolithic microwave integrated circuits (MMICs) | Anurag Gupta, David H. Altman, Christopher R. Koontz | 2016-11-22 |
| 9218989 | Aerogel dielectric layer | Mark S. Hauhe, Terry C. Cisco, Paul Nahass, George L. Gould, Nick Zafiropoulos | 2015-12-22 |
| 8982931 | RF puck | John P. Gianvittorio, Frederick A. Dominski | 2015-03-17 |
| 8921992 | Stacked wafer with coolant channels | Christopher R. Koontz, Tse E. Wong | 2014-12-30 |
| 8653673 | Method for packaging semiconductors at a wafer level | Robert B. Hallock, William John Davis, Yiwen Zhang, Ward G. Fillmore, Susan C. Trulli | 2014-02-18 |
| 8648759 | Variable height radiating aperture | Allen Wang, Fangchou Yang | 2014-02-11 |
| 8209846 | Methods for producing large flat panel and conformal active array antennas | Avery Y. Quil, Clifton Quan, Alec Ekrnekjl | 2012-07-03 |
| 7631414 | Methods for producing large flat panel and conformal active array antennas | Avery Y. Quil, Clifton Quan, Alec Ekmekji | 2009-12-15 |