Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12385697 | Micropillar-enabled thermal ground plane | Ryan John Lewis, Li-Anne Liew, Ching-Yi Lin, Collin Jennings Coolidge, Shanshan Xu +1 more | 2025-08-12 |
| 12188732 | Single and multi-layer mesh structures for enhanced thermal transport | Ronggui Yang, Rongfu Wen, Shanshan Xu | 2025-01-07 |
| 12104856 | Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems | Ryan John Lewis, Ronggui Yang | 2024-10-01 |
| 11988453 | Thermal management planes | Ryan John Lewis, Ronggui Yang | 2024-05-21 |
| 11930621 | Folding thermal ground plane | Ryan John Lewis, Ali Nematollahisarvestani, Jason West, Kyle Wagner | 2024-03-12 |
| 11898807 | Single and multi-layer mesh structures for enhanced thermal transport | Ronggui Yang, Rongfu Wen, Shanshan Xu | 2024-02-13 |
| 11598594 | Micropillar-enabled thermal ground plane | Ryan John Lewis, Li-Anne Liew, Ching-Yi Lin, Collin Jennings Coolidge, Shanshan Xu +1 more | 2023-03-07 |
| 11511377 | Conformal thermal ground planes | Michael Hulse, William Francis | 2022-11-29 |
| 11353269 | Thermal ground plane | Ronggui Yang, Victor M. Bright, Chen Li, Christopher Oshman, Bo Shi +2 more | 2022-06-07 |
| 11306983 | Single and multi-layer mesh structures for enhanced thermal transport | Ronggui Yang, Rongfu Wen, Shanshan Xu | 2022-04-19 |
| 10731925 | Micropillar-enabled thermal ground plane | Ryan John Lewis, Li-Anne Liew, Ching-Yi Lin, Collin Jennings Coolidge, Shanshan Xu +1 more | 2020-08-04 |
| 10724804 | Method and device for spreading high heat fluxes in thermal ground planes | Ryan John Lewis, Ronggui Yang | 2020-07-28 |
| 10571200 | Thermal ground plane | Ronggui Yang, Victor M. Bright, Chen Li, Christopher Oshman, Bo Shi +2 more | 2020-02-25 |
| 10527358 | Thermal ground plane | Ronggui Yang, Victor M. Bright, Chen Li, Christopher Oshman, Bo Shi +2 more | 2020-01-07 |
| 10458716 | Conformal thermal ground planes | Michael Hulse, William Francis | 2019-10-29 |
| 10446466 | Mechanically improved microelectronic thermal interface structure for low die stress | Jason G. Milne, Tse E. Wong | 2019-10-15 |
| 9921004 | Polymer-based microfabricated thermal ground plane | Ryan John Lewis, Li-Anne Liew, Yunda Wang | 2018-03-20 |
| 9909814 | Flexible thermal ground plane and manufacturing the same | Ronggui Yang, Victor M. Bright, Chen Li, Christopher Oshman, Bo Shi +2 more | 2018-03-06 |
| 9651312 | Flexible thermal ground plane and manufacturing the same | Ronggui Yang, Victor M. Bright, Chen Li, Christopher Oshman, Bo Shi +2 more | 2017-05-16 |
| 9163883 | Flexible thermal ground plane and manufacturing the same | Ronggui Yang, Victor M. Bright, Chen Li, Christopher Oshman, Bo Shi +2 more | 2015-10-20 |
| 7426067 | Atomic layer deposition on micro-mechanical devices | Victor M. Bright, Jeffrey W. Elam, Francois H. Fabreguette, Steven M. George, Nils D. Hoivik +2 more | 2008-09-16 |
| 5497258 | Spatial light modulator including a VLSI chip and using solder for horizontal and vertical component positioning | Teh-Hua Ju, Wei-Feng Lin | 1996-03-05 |
| 5049982 | Article comprising a stacked array of electronic subassemblies | John M. Segelken | 1991-09-17 |