FF

Francois H. Fabreguette

Micron: 12 patents #1,275 of 6,345Top 25%
UC University of Colorado: 1 patents #288 of 930Top 35%
📍 Boulder, CO: #493 of 5,018 inventorsTop 10%
🗺 Colorado: #3,126 of 40,980 inventorsTop 8%
Overall (All Time): #340,379 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #TitleCo-InventorsDate
12150303 Integrated assemblies having charge-trapping material arranged in vertically-spaced segments, and methods of forming integrated assemblies Byeung Chul Kim, Richard J. Hill, Purnima Narayanan, Shyam Surthi 2024-11-19
11715692 Microelectronic devices including conductive rails, and related methods John D. Hopkins, Jordan D. Greenlee, John Smythe 2023-08-01
11672118 Electronic devices comprising adjoining oxide materials and related systems Shyam Surthi, Richard J. Hill, Gurtej S. Sandhu, Byeung Chul Kim, Chris M. Carlson +2 more 2023-06-06
11672120 Integrated assemblies having charge-trapping material arranged in vertically-spaced segments, and methods of forming integrated assemblies Byeung Chui Kim, Richard J. Hill, Purnima Narayanan, Shyam Surthi 2023-06-06
11631697 Integrated assemblies having vertically-extending channel material with alternating regions of different dopant distributions, and methods of forming integrated assemblies Shyam Surthi, Byeung Chul Kim, Richard J. Hill, Gurtej S. Sandhu 2023-04-18
11557608 Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies Byeung Chul Kim, Richard J. Hill, Shyam Surthi 2023-01-17
11289501 Integrated assemblies having vertically-extending channel material with alternating regions of different dopant distributions, and methods of forming integrated assemblies Shyam Surthi, Byeung Chul Kim, Richard J. Hill, Gurtej S. Sandhu 2022-03-29
11127830 Apparatus with multidielectric spacers on conductive regions of stack structures, and related methods John Smythe, Silvia Borsari, Sutharsan Ketharanathan 2021-09-21
11107830 Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies Byeung Chul Kim, Richard J. Hill, Shyam Surthi 2021-08-31
11037956 Integrated assemblies having charge-trapping material arranged in vertically-spaced segments, and methods of forming integrated assemblies Byeung Chul Kim, Richard J. Hill, Purnima Narayanan, Shyam Surthi 2021-06-15
10964536 Formation of an atomic layer of germanium in an opening of a substrate material having a high aspect ratio Paul A. Paduano, Gurtej S. Sandhu, John Smythe, Matthew N. Rocklein 2021-03-30
10937654 Methods of doping a silicon-containing material and methods of forming a semiconductor device John Smythe, Witold Kula 2021-03-02
10777576 Integrated assemblies having charge-trapping material arranged in vertically-spaced segments, and methods of forming integrated assemblies Byeung Chul Kim, Richard J. Hill, Purnima Narayanan, Shyam Surthi 2020-09-15
7426067 Atomic layer deposition on micro-mechanical devices Victor M. Bright, Jeffrey W. Elam, Steven M. George, Nils D. Hoivik, Yung-Cheng Lee +2 more 2008-09-16