Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12385697 | Micropillar-enabled thermal ground plane | Ryan John Lewis, Ching-Yi Lin, Collin Jennings Coolidge, Shanshan Xu, Ronggui Yang +1 more | 2025-08-12 |
| 11598594 | Micropillar-enabled thermal ground plane | Ryan John Lewis, Ching-Yi Lin, Collin Jennings Coolidge, Shanshan Xu, Ronggui Yang +1 more | 2023-03-07 |
| 10731925 | Micropillar-enabled thermal ground plane | Ryan John Lewis, Ching-Yi Lin, Collin Jennings Coolidge, Shanshan Xu, Ronggui Yang +1 more | 2020-08-04 |
| 9921004 | Polymer-based microfabricated thermal ground plane | Ryan John Lewis, Yung-Cheng Lee, Yunda Wang | 2018-03-20 |