Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8653673 | Method for packaging semiconductors at a wafer level | William John Davis, Yiwen Zhang, Ward G. Fillmore, Susan C. Trulli, Jason G. Milne | 2014-02-18 |
| 8581406 | Flip chip mounted monolithic microwave integrated circuit (MMIC) structure | James A. Robbins, William John Davis | 2013-11-12 |
| RE44303 | Passivation layer for a circuit device and method of manufacture | John M. Bedinger, Michael A. Moore, Kamal Tabatabaie, Thomas E. Kazior | 2013-06-18 |
| 7902083 | Passivation layer for a circuit device and method of manufacture | John M. Bedinger, Michael A. Moore, Kamal Tabatabaie Alavi, Thomas E. Kazior | 2011-03-08 |
| 7767589 | Passivation layer for a circuit device and method of manufacture | John M. Bedinger, Michael A. Moore, Kamal Tabatabaie Alavi, Thomas E. Kazior | 2010-08-03 |
| 7692222 | Atomic layer deposition in the formation of gate structures for III-V semiconductor | Kamal Tabatabaie | 2010-04-06 |
| 6707017 | High-power microwave window | Weldon S. Williamson, Charles B. Willingham, Richard Alexy | 2004-03-16 |
| 4847399 | Process for preparing or purifying Group III-A organometallic compounds | Stephen J. Manzik, Thomas Jake Mitchell, Benjamin C. Hui | 1989-07-11 |