| 12271068 |
Heterogeneous integration and electro-optic modulation of III-nitride photonics on a silicon photonic platform |
Moe D. Soltani |
2025-04-08 |
|
| 11784248 |
Group III-V semiconductor structures having crystalline regrowth layers and methods for forming such structures |
Jeffrey R. LaRoche, Kelly P. Ip, Eduardo M. Chumbes |
2023-10-10 |
|
| 11754865 |
Hetergenous integration and electro-optic modulation of III-nitride photonics on a silicon photonic platform |
Moe D. Soltani |
2023-09-12 |
|
| 11747704 |
Integration of electronics with lithium niobate photonics |
Moe D. Soltani, Jeffrey R. LaRoche |
2023-09-05 |
|
| 11515410 |
Group III-V semiconductor structures having crystalline regrowth layers and methods for forming such structures |
Jeffrey R. LaRoche, Kelly P. Ip, Eduardo M. Chumbes |
2022-11-29 |
|
| 11340512 |
Integration of electronics with Lithium Niobate photonics |
Moe D. Soltani, Jeffrey R. LaRoche |
2022-05-24 |
|
| 11239326 |
Electrode structure for field effect transistor |
Jeffrey R. LaRoche, Kelly P. Ip, Kamal Tabatabaie Alavi |
2022-02-01 |
|
| 11177216 |
Nitride structures having low capacitance gate contacts integrated with copper damascene structures |
Jeffrey R. LaRoche, Eduardo M. Chumbes, Kelly P. Ip |
2021-11-16 |
|
| 10930742 |
Wafer structure with mode suppression |
Hooman Kazemi, Mark J. Rosker, Shane A. O'Connor, Emily Elswick |
2021-02-23 |
|
| 10224285 |
Nitride structure having gold-free contact and methods for forming such structures |
Jeffrey R. LaRoche, Eduardo M. Chumbes, Kelly P. Ip |
2019-03-05 |
$22,193,000 |
| 10096550 |
Nitride structure having gold-free contact and methods for forming such structures |
Jeffrey R. LaRoche, Eduardo M. Chumbes, Kelly P. Ip |
2018-10-09 |
$24,862,000 |
| 9761445 |
Methods and structures for forming microstrip transmission lines on thin silicon carbide on insulator (SICOI) wafers |
Jeffrey R. LaRoche, Kelly P. Ip |
2017-09-12 |
$19,039,000 |
| 9478508 |
Microwave integrated circuit (MMIC) damascene electrical interconnect for microwave energy transmission |
Jeffrey R. LaRoche, John P. Bettencourt, Kelly P. Ip |
2016-10-25 |
$20,150,000 |
| 9231064 |
Double heterojunction group III-nitride structures |
Shahed Reza, Eduardo M. Chumbes, Gerhard Sollner |
2016-01-05 |
$13,340,000 |
| 8575666 |
Method and structure having monolithic heterogeneous integration of compound semiconductors with elemental semiconductor |
Jeffrey R. LaRoche, William E. Hoke |
2013-11-05 |
$13,658,000 |
| RE44303 |
Passivation layer for a circuit device and method of manufacture |
John M. Bedinger, Michael A. Moore, Robert B. Hallock, Kamal Tabatabaie |
2013-06-18 |
|
| 8466555 |
Gold-free ohmic contacts |
Ram V. Chelakara, Jeffrey R. LaRoche |
2013-06-18 |
$6,593,000 |
| 7902083 |
Passivation layer for a circuit device and method of manufacture |
John M. Bedinger, Michael A. Moore, Robert B. Hallock, Kamal Tabatabaie Alavi |
2011-03-08 |
$14,607,000 |
| 7767589 |
Passivation layer for a circuit device and method of manufacture |
John M. Bedinger, Michael A. Moore, Robert B. Hallock, Kamal Tabatabaie Alavi |
2010-08-03 |
$5,400,000 |
| 7387958 |
MMIC having back-side multi-layer signal routing |
Christopher P. McCarroll, Jerome H. Pozgay, Steven M. Lardizabal, Michael G. Adlerstein |
2008-06-17 |
$29,630,000 |
| 6175287 |
Direct backside interconnect for multiple chip assemblies |
James L. Lampen, Paul Setzco, Michael G. Kizner, John P. Wendler |
2001-01-16 |
|
| 5343071 |
Semiconductor structures having dual surface via holes |
John Huang |
1994-08-30 |
$38,199,000 |
| 4970578 |
Selective backside plating of GaAs monolithic microwave integrated circuits |
Elsa K. Tong |
1990-11-13 |
$26,783,000 |
| 4968637 |
Method of manufacture TiW alignment mark and implant mask |
Robert L. Mozzi |
1990-11-06 |
$26,361,000 |
| 4927784 |
Simultaneous formation of via hole and tube structures for GaAs monolithic microwave integrated circuits |
Mark S. Durschlag |
1990-05-22 |
$5,382,000 |
