Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9362237 | Air bridge structure having dielectric coating | Paul J. Duval | 2016-06-07 |
| 9219024 | Air bridge structure having dielectric coating | Paul J. Duval | 2015-12-22 |
| 8969176 | Laminated transferable interconnect for microelectronic package | William John Davis | 2015-03-03 |
| 8653673 | Method for packaging semiconductors at a wafer level | Robert B. Hallock, William John Davis, Yiwen Zhang, Susan C. Trulli, Jason G. Milne | 2014-02-18 |
| 8178391 | Method for packaging semiconductors at wafer level | William John Davis, Scott MacDonald | 2012-05-15 |
| 8035219 | Packaging semiconductors at wafer level | William John Davis, Scott MacDonald | 2011-10-11 |