Issued Patents All Time
Showing 1–25 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261186 | Mosaic focal plane array | David J. Gulbransen, Sean P. Kilcoyne, Eric R. Miller, Matthew D. Chambers, Eric J. Beuville +1 more | 2025-03-25 |
| 11750945 | Imager with integrated asynchronous laser pulse detection having a signal component along a second electrical pathway passes through an ALPD readout integrated circuit to an imaging readout integrated circuit | Michael J. Batinica, Scott M. Taylor, Sean P. Kilcoyne, Paul Bryant | 2023-09-05 |
| 11284025 | Digital pixel having high sensitivity and dynamic range | Neil R. Malone, Micky R. Harris, George Paloczi, John L. Vampola, Christian Boemler | 2022-03-22 |
| 10451487 | Per-pixel dark reference bolometer | Eli E. Gordon, Eric J. Beuville, Ryan Boesch, Jeffrey K. Hamers | 2019-10-22 |
| 10315918 | Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays | Roland W. Gooch, Buu Q. Diep, Stephen H. Black, Thomas A. Kocian | 2019-06-11 |
| 10267997 | Infrared scene projector with per-pixel spectral and polarisation capability | Justin Gordon Adams Wehner, Duane D. Smith, Edward P. Smith | 2019-04-23 |
| 10262913 | Wafer level package solder barrier used as vacuum getter | Roland W. Gooch, Buu Q. Diep, Stephen H. Black, Thomas A. Kocian | 2019-04-16 |
| 9969610 | Wafer level MEMS package including dual seal ring | Buu Q. Diep, Thomas A. Kocian, Mark A. Lamb | 2018-05-15 |
| 9966320 | Wafer level package solder barrier used as vacuum getter | Roland W. Gooch, Buu Q. Diep, Stephen H. Black, Thomas A. Kocian | 2018-05-08 |
| 9865519 | Use of an external getter to reduce package pressure | Stephen H. Black | 2018-01-09 |
| 9771258 | Wafer level MEMS package including dual seal ring | Buu Q. Diep, Thomas A. Kocian, Mark A. Lamb | 2017-09-26 |
| 9708181 | Hermetically sealed package having stress reducing layer | Buu Q. Diep, Stephen H. Black, Tse E. Wong, Thomas A. Kocian, Gregory D. Tracy | 2017-07-18 |
| 9570321 | Use of an external getter to reduce package pressure | Stephen H. Black | 2017-02-14 |
| 9520332 | Wafer level package solder barrier used as vacuum getter | Roland W. Gooch, Buu Q. Diep, Stephen H. Black, Thomas A. Kocian | 2016-12-13 |
| 9427776 | Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays | Roland W. Gooch, Buu Q. Diep, Stephen H. Black, Thomas A. Kocian | 2016-08-30 |
| 9334154 | Hermetically sealed package having stress reducing layer | Buu Q. Diep, Stephen H. Black, Tse E. Wong, Thomas A. Kocian, Gregory D. Tracy | 2016-05-10 |
| 9227839 | Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling | Roland W. Gooch, Stephen H. Black, Thomas A. Kocian, Buu Q. Diep | 2016-01-05 |
| 9196556 | Getter structure and method for forming such structure | Roland W. Gooch, Stephen H. Black, Thomas A. Kocian, Buu Q. Diep | 2015-11-24 |
| 9187312 | Integrated bondline spacers for wafer level packaged circuit devices | Roland W. Gooch, Buu Q. Diep, Thomas A. Kocian, Stephen H. Black | 2015-11-17 |
| 9174836 | Integrated bondline spacers for wafer level packaged circuit devices | Roland W. Gooch, Buu Q. Diep, Thomas A. Kocian, Stephen H. Black | 2015-11-03 |
| 9105800 | Method of forming deposited patterns on a surface | Roland W. Gooch, Thomas A. Kocian, Buu Q. Diep, Stephen H. Black | 2015-08-11 |
| 9091748 | Methods and apparatus for 3D UV imaging | Michael D. Jack, James F. Asbrock, Frank B. Jaworski | 2015-07-28 |
| 9093444 | Wafer level package solder barrier used as vacuum getter | Roland W. Gooch, Buu Q. Diep, Stephen H. Black, Thomas A. Kocian | 2015-07-28 |
| 8928883 | Optical device for detection of an agent | Frank B. Jaworski, Justin Gordon Adams Wehner, Darin S. Williams, Anuradha M. Agarwal, Juejun Hu | 2015-01-06 |
| 8653467 | Multichip packaging for imaging system | Stephen H. Black, Michael A. Gritz | 2014-02-18 |