Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10315918 | Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays | Roland W. Gooch, Buu Q. Diep, Stephen H. Black, Adam M. Kennedy | 2019-06-11 |
| 10262913 | Wafer level package solder barrier used as vacuum getter | Roland W. Gooch, Buu Q. Diep, Adam M. Kennedy, Stephen H. Black | 2019-04-16 |
| 9969610 | Wafer level MEMS package including dual seal ring | Buu Q. Diep, Adam M. Kennedy, Mark A. Lamb | 2018-05-15 |
| 9966320 | Wafer level package solder barrier used as vacuum getter | Roland W. Gooch, Buu Q. Diep, Adam M. Kennedy, Stephen H. Black | 2018-05-08 |
| 9771258 | Wafer level MEMS package including dual seal ring | Buu Q. Diep, Adam M. Kennedy, Mark A. Lamb | 2017-09-26 |
| 9708181 | Hermetically sealed package having stress reducing layer | Adam M. Kennedy, Buu Q. Diep, Stephen H. Black, Tse E. Wong, Gregory D. Tracy | 2017-07-18 |
| 9520332 | Wafer level package solder barrier used as vacuum getter | Roland W. Gooch, Buu Q. Diep, Adam M. Kennedy, Stephen H. Black | 2016-12-13 |
| 9427776 | Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays | Roland W. Gooch, Buu Q. Diep, Stephen H. Black, Adam M. Kennedy | 2016-08-30 |
| 9334154 | Hermetically sealed package having stress reducing layer | Adam M. Kennedy, Buu Q. Diep, Stephen H. Black, Tse E. Wong, Gregory D. Tracy | 2016-05-10 |
| 9227839 | Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling | Roland W. Gooch, Stephen H. Black, Adam M. Kennedy, Buu Q. Diep | 2016-01-05 |
| 9196556 | Getter structure and method for forming such structure | Roland W. Gooch, Adam M. Kennedy, Stephen H. Black, Buu Q. Diep | 2015-11-24 |
| 9187312 | Integrated bondline spacers for wafer level packaged circuit devices | Roland W. Gooch, Buu Q. Diep, Stephen H. Black, Adam M. Kennedy | 2015-11-17 |
| 9174836 | Integrated bondline spacers for wafer level packaged circuit devices | Roland W. Gooch, Buu Q. Diep, Stephen H. Black, Adam M. Kennedy | 2015-11-03 |
| 9132496 | Reducing formation of oxide on solder | Buu Q. Diep, Roland W. Gooch | 2015-09-15 |
| 9105800 | Method of forming deposited patterns on a surface | Roland W. Gooch, Buu Q. Diep, Adam M. Kennedy, Stephen H. Black | 2015-08-11 |
| 9093444 | Wafer level package solder barrier used as vacuum getter | Roland W. Gooch, Buu Q. Diep, Adam M. Kennedy, Stephen H. Black | 2015-07-28 |
| 9022584 | Protecting an optical surface | Stephen H. Black, Buu Q. Diep | 2015-05-05 |
| 8844793 | Reducing formation of oxide on solder | Buu Q. Diep, Roland W. Gooch | 2014-09-30 |
| 8809784 | Incident radiation detector packaging | Roland W. Gooch, Stephen H. Black, Buu Q. Diep | 2014-08-19 |
| 8736045 | Integrated bondline spacers for wafer level packaged circuit devices | Roland W. Gooch, Buu Q. Diep, Stephen H. Black, Allan M. Kennedy | 2014-05-27 |
| 8608894 | Wafer level packaged focal plane array | Stephen H. Black | 2013-12-17 |
| 7466018 | MEMS device wafer-level package | Richard L. Knipe, Mark Strumpell | 2008-12-16 |
| 7226810 | MEMS device wafer-level package | Richard L. Knipe, Mark Strumpell | 2007-06-05 |
| 6908791 | MEMS device wafer-level package | Richard L. Knipe, Mark Strumpell | 2005-06-21 |
| 6762868 | Electro-optical package with drop-in aperture | Jwei Liu | 2004-07-13 |